“…In fact, the maturity of the proposed preparation method is verified by its successful application in a handful of the studies elsewhere F I G U R E 4 SEM images showing the plan-view FIB liftout steps from the cleaved wedge: 4.1 milling trench from the substrate-side (a), 4.2 milling frame around lamella (b), 4.3 milling electron transparent window from the substrate-and film-sides (c), 4.4 transfer to the MEMS chip, (d) and 4.5 final sample (e). High-magnification STEM images recorded from as prepared film Bakhit, Palisaitis, Thörnberg, et al, 2020;Bakhit et al, 2021;Dorri et al, 2021;Mockute et al, 2019;Mockuté et al, 2017;Nedfors et al, 2016;Nedfors et al, 2019;Nedfors et al, 2020;Novoselova et al, 2018;Palisaitis et al, 2021;Thörnberg et al, 2020). Further, it was observed that for films with a weak adhesion to the substrate, proposed sample cleaving produce (Figure 1) produces the cleave wedge with the substrate-fee films sticking out from the wedge.…”