In this work, the properties of polyimide (PI) as the dielectric film are systematically investigated. PI films are processed by spin-coating method at various conditions. Subsequently, the leakage current, unit-area capacitance and morphologies of these films are characterized. Then anti-solvent property is certified by comparing the films before and after the solvent treatments. Organic filed-effect transistors based on PI dielectric films and pentacene active films show uniform performance distribution in large area. Furthermore, a single crystal of 2,7-dihexyl-dibenzo[d, d′]thieno[3,2-b;4,5-b′]dithiophene (C6-DBTDT)is obtained on the PI film by solution-processed method and exhibits good electrical properties with the highest mobility of 3 cm 2 V -1 s -1 and I on /I off > 10 5 . It is believed that this kind of PI polymer dielectric film has potential application in solution-processed, flexible and large-area organic electronics.. Therefore, it is necessary to introduce a new polymer dielectric that can endure this oppressive preparation process.Polyimide (PI) is a good candidate of polymer dielectric film 24-26 and in our work, we do systematical research on this polymeric insulator. The leakage current, unit-area capacitance and the morphologies of these films are characterized. Then anti-solvent property is certified by comparing these films before and after organic solvent treatment. Large-area thin film OFET arrays show uniform mobility and threshold voltage distribution. Furthermore, solution-processed single crystal OFETsare built on the PI films. Bottom-gate top-contact OFETs are constructed by manually gluing Au-films, which exhibit excellent electrical properties with the highest mobility up to 3 cm 2 V -1 s -1 and I on /I off > 10 5 . It is believed that this kind of polymer insulator has potential application in solution-processed organic electronics.
Experimental sectionIn this work, PI films were prepared by spin-coating onto indium tin oxide (ITO) substrates and all substrates were cleaned with deionized water, acetone, and isopropyl alcohol in ultrasound for 10 minutes respectively, and then dried with quickly purged N 2 . The substrates were further cleaned in oxygen plasma for 5 minutes. PI precursor (polyimide acid, PAA) films were firstly spin-coated on ITO substrates at different speed (2000 rpm, 4000 rpm, 6000 rpm and 8000rpm) for 30 seconds. Then, these films were cross-linked to form solid PI films with annealing temperature of 300 o C. After that, the morphologies and thicknesses of these films were investigated by atomic force microscope (AFM) with tapping mode.In order to measure the leakage current and unit-area capacitance of PI films, the devices with ITO/PI/Au (100 nm) sandwich structure were fabricated. The specific capacitance as a function of frequency based on PI film was tested by electrochemical method. The leakage current of PI was characterized by Keithley 4200-SCS semiconductor analyzer. Bottom-gate top-contact OFETs were fabricated employing PI as dielectric film, p...