Al–Zn–Sn phase diagram – isothermal diffusion in ternary system

The wetting time, wetting force, contact angle and interfacial reaction of and Sn-9Zn (mass%) lead-free solders on Cu and Cu/Ni-P/Au substrates have been investigated. The Ag content, X, of the solders investigated was 0-3 mass%. The results indicate that the wettability of Sn-8.55Zn-0.45Al-XAg solders decreases with increasing Ag content. The Sn-8.55Zn-0.45Al-XAg solders containing low Ag content, less than 1mass%, exhibit better wettability than the eutectic Sn-9Zn solder. Furthermore, it was also found that the wettability of Sn-Zn based solders on Cu substrate is better than that on Cu/Ni-P/Au substrate. The when used on Cu and Cu/Ni-P/Au, Sn-9Zn solder forms Cu 5 Zn 8 and AuZn 3 respectively, while the Al-containing solders form Al 4:2 Cu 3:2 Zn 0:7 and Al 2 (Au, Zn). Further addition of Ag gave rise to AgZn 3 particles attached to the underlying intermetallic compound.

Section: Introductionmentioning

confidence: 99%

Wetting Properties of and Interfacial Reactions in Lead-free Sn-Zn Based Solders on Cu and Cu Plated with an Electroless Ni-P/Au Layer

Huang

Lin

2004

“…The ternary phase diagram was studied by Vicent and Seboun 12,13,41,42) and a critical evaluation of different reported investigations is given by Hubert-Protopopescu and Hubert. 15) Standard CALPHAD procedures were used to as- Fig.…”

Section: (4) Aluminum-tin-zinc Systemmentioning

confidence: 99%

“…11) Extensive experimental studies of the ternary phase diagrams were carried out by Vincent and Sebaoun 12) and Sebaoun et al 13) An assessment of the Al-Sn-Zn system was carried out by Fries et al 14) and an evaluation of all the literature data is given by HubertProtopopescu and Hubert.…”

Section: Introductionmentioning

confidence: 99%

Thermodynamic Properties of Liquid Al-Sn-Zn Alloys: A Possible New Lead-Free Solder Material

Knott¹,

Mikula²

2002

Because of its potential to be used as a lead free solder material the thermodynamic properties of the liquid Al-Sn-Zn system were investigated. Using an appropriate galvanic cell, the partial free energies of Al were determined as a function of concentration and temperature. Thermodynamic properties were obtained for 30 alloys. Their composition was situated on three cross-sections with constant ratios of Sn:Zn = 2:1, 1:1 and 1:2. The integral Gibbs energy and the integral enthalpy for the ternary system at 973 K were calculated by Gibbs-Duhem integration.

“…Also, these alloys should not contain hazardous metals. The following eutectic alloys were reported to be as close as possible to these requirements: Sn-Zn with 472 K, 3) Sn-Zn-Al with 472.7 K 4,5) and Sn-Mg 2 Sn with 476.5 K. 6) However, all of their eutectic temperatures are still higher than desired. Recently, a Sn-ZnMg 2 Sn eutectic alloy with 455 K was found by a thermodynamic caluculation.…”

Section: Introductionmentioning

confidence: 96%

Eutectic Alloys in the Sn-Zn-Mg-Al System with Eutectic Temperature of 454 K

Inada¹,

Kibe²

2004

We have experimentally found a Sn-Zn-Mg 2 Sn eutectic alloy with the eutectic composition of 82Sn-10Zn-8Mg (mol%) and with nearly the same eutectic temperature of 454 K as that of the Pb-Sn eutectic alloy. The eutectic alloy was made in air by covering Sn, Zn and Mg with the 59KCl-41LiCl (mol%) composition eutectic melt in an Al 2 O 3 crucible, melting the metals at 1073 K and washing away the alkali-chlorides with distilled water after cooling to room temperature. The as-cast alloy easily oxidized at temperatures above 503 K in air after melting. It was found that the Sn-Zn-(Mg, Al) 2 Sn eutectic alloys that were made by replacing 0.8 to 4.0 mol% of Mg with Al in the ternary eutectic composition with the same alloying method did not oxidize in air after melting.