2004
DOI: 10.1002/lsm.20081
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Albumin–genipin solder for laser tissue repair

Abstract: Addition of a chemical crosslinking agent, such as genipin, significantly increased the tensile strength of adhesive-tissue bonds. A proposed mechanism for this enhanced bond strength is the synergistic action of mechanical adhesion with chemical crosslinking by genipin.

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Cited by 35 publications
(32 citation statements)
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“…For the initial improvement of tensile strength and a consequent limitation of thermal damage the use of albumin solders is very beneficial [19]. In this study, we used BSA for soldering.…”
Section: Discussionmentioning
confidence: 99%
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“…For the initial improvement of tensile strength and a consequent limitation of thermal damage the use of albumin solders is very beneficial [19]. In this study, we used BSA for soldering.…”
Section: Discussionmentioning
confidence: 99%
“…To increase initial tensile strength of the wound solders have successfully been applied improving laser-mediated tissue welding through denaturation and bond formation [18]. Albumin as a solder for laser tissue fusion has been studied and employed in different clinical and experimental settings [19]. Exsudating wounds show abundant albumin concentrations, which might even redundantize exogenous albumin application.…”
Section: Introductionmentioning
confidence: 99%
“…The numbers in brackets indicate the reference from which the data were obtained. of PLGA ssLAVR was improved with the addition of the protein cross-linking agent genipin [107], which enhances cohesive and adhesive bonding and thereby increases the stability of the weld ( Figure 11C). With the addition of genipin, 80% of the end-to-end sutureless PLGA ssLAVAed carotid arteries withstood a 24-h ex vivo hemodynamic test without bursting or leaking (Figure 12) [108].…”
Section: Laser-scaffold Interactionsmentioning
confidence: 99%
“…With an optimal combination of chromophore concentration and lasing parameters, denaturation that starts at the solder base, as observed with solders containing high albumin content, potentially produces stronger adhesive bonding than the superficial denaturation seen with low albumin content solders. Furthermore, adhesive bonding can be increased by the addition of a protein cross-linking agent such as genipin, which chemically cross-links albumin to tissue collagens [107,111].…”
Section: Improvements In Adhesive Bondingmentioning
confidence: 99%
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