Aligned Graphene Oxide Nanofillers: An Approach to Prepare Highly Thermally Conductive and Electrically Insulative Transparent Polymer Composites

Lin, Genlian; Xie, Bin-Huan; Hu, Juan; Huang, Xiao; Zhang, Guojun

doi:10.1155/2015/957068

Cited by 10 publications

(8 citation statements)

References 17 publications

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“…A broad peak at 10 °C can easily restack upon drying. This was reported previously by Genlian et al [44]. PANI recorded three peaks at 21.09°, 25.73° and 27.43°.…”

Section: Xrd Diffractogram Of Go and Pani/gosupporting

confidence: 86%

“…The wrinkled structure had weakened the interfacial interaction between PANI and GO thus disrupted the electron movement in the composites. The electrical resistance of GO recorded by Lin et al was 3.1 to 3.8 × 10 5 Ω m which was close to the pure value of polyvinyl alcohol [44].…”

Section: Ft-ir Analysis Of Pani Go and Pani/go Composites At Differesupporting

confidence: 67%

“…Low-conductivity domains had conquered most of the GO region which later reduced the pathway of the current flow, thus affected the conductivity. According to Lin et al [44], GO tended to restack and form wrinkled structure which interrupted the formation of percolation network and reduced the aspect ratio of the filler. This contributed to the low electrical conductivities of GO and PANI/GO composites as shown in Fig.…”

Section: Ft-ir Analysis Of Pani Go and Pani/go Composites At Differementioning

confidence: 99%

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Properties of polyaniline/graphene oxide (PANI/GO) composites: effect of GO loading

et al. 2020

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Polyaniline/graphene oxide (PANI/GO) composites at different wt% of GO were prepared via solution method. PANI was mixed with the GO synthesized from the improved Hummer's method. The formation of GO was confirmed via Raman and C/O ratio. Based on the FT-IR, XRD and SEM results, it confirmed the presence of both PANI and GO characteristics at 10.9°, 25.8° and 27.8° and interactions between PANI and GO particles in PANI/GO composites at different GO loading. SEM micrographs showed a folding and wrinkled surface of GO due to the defect upon oxidation process. This means that the weak π-π interactions or the agglomeration of GO have caused PANI unable to attach on the large conjugated basal planes of GO sheets. The defective domains made GO as an insulator as it contained distortions and oxygen-containing functional groups and their local decoration. Lowconductivity domain had conquered most of the GO region which later reduced the pathway of the current flow; therefore, conductivity is affected. The wrinkled structure also resulted in the low conductivity as it weakens the interfacial interaction between PANI and GO and thus disrupted the electron movement in the composites. Due to this, the electrical conductivity reached up to 1.83 × 10 −10 S/cm as the GO loading increased to 50 wt%.

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“…A broad peak at 10 °C can easily restack upon drying. This was reported previously by Genlian et al [44]. PANI recorded three peaks at 21.09°, 25.73° and 27.43°.…”

Section: Xrd Diffractogram Of Go and Pani/gosupporting

confidence: 86%

Section: Ft-ir Analysis Of Pani Go and Pani/go Composites At Differesupporting

confidence: 67%

Section: Ft-ir Analysis Of Pani Go and Pani/go Composites At Differementioning

confidence: 99%

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Properties of polyaniline/graphene oxide (PANI/GO) composites: effect of GO loading

et al. 2020

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“…Compared with the metallic and ceramic fillers, nanostructured carbon fillers have attracted more intensive interests because of their high thermal conductivity. For example, expanded graphite (EG) has a thermal conductivity of about 300 W·m -1 ·K -1 [105], graphene nanoplate (GNP) possesses a thermal conductivity as high as 1000-5000 W·m -1 ·K -1 [106][107][108][109][110], and CNTs are regarded as the most promising candidates owing to their high mechanical strength, chemical stability and high thermal conductivity of 1000~3000 W·m -1 ·K -1 [111][112][113][114].…”

Section: Thermal Conductivity Of Polymer Nanocompositesmentioning

confidence: 99%

Thermal conductivity of polymers and polymer nanocomposites

Huang

Qian

Yang

2018

Materials Science and Engineering: R: Reports

673

391

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Polymers are widely used in industry and in our daily life because of their diverse functionality, light weight, low cost and excellent chemical stability. However, on some applications such as heat exchangers and electronic packaging, the low thermal conductivity of polymers is one of the major technological barriers. Enhancing the thermal conductivity of polymers is important for these applications and has become a very active research topic over the past two decades. In this review article, we aim to: 1). systematically summarize the molecular level understanding on the thermal transport mechanisms in polymers in terms of polymer morphology, chain structure and inter-chain coupling; 2). highlight the rationales in the recent efforts in enhancing the thermal conductivity of nanostructured polymers and polymer nanocomposites. Finally, we outline the main advances, challenges and outlooks for highly thermal-conductive polymer and polymer nanocomposites. the inter-chain coupling. Fig. 1 Schematic diagrams of a polymer: (a) the morphology of a polymer consisting of crystalline and amorphous domains; (b) structure of a polymer chain.In addition to engineering the morphology of polymer chains, another common method to enhance the thermal conductivity of polymers is to blend polymers with highly thermal conductive fillers. The progress of nanotechnology over the last two decades not only provides more diverse high thermal conductivity fillers of different material types and topological shapes but also advances the understanding at the nanoscale. Fig. 2 shows a sketch of a polymer nanocomposite to illustrate the thermal transport mechanisms. In general, there are two types of polymer nanocomposites depending on whether nano-fillers form a network or not. When the filler concentration is low, no inter-filler networks could be formed, as shown in Fig. 2(a). The thermal conductivity is essentially determined by the filler-matrix coupling, i.e, interfacial thermal resistance, and the concentration and the geometric shapes of fillers. When the filler concentration is large enough, high conductivity fillers might form thermally conductive networks, as shown in Fig. 2(b). Although nanocomposites with filler network could possess a higher thermal conductivity than that without a network, their thermal conductivity could still be low due to the large inter-filler thermal contact resistance. Recently, three-dimensional fillers, such as carbon and graphene foams, have drawn a lot of attention. The fundamental thermal transport mechanisms and recent synthesis efforts in both types of nanocomposites are reviewed.This review article is organized as follows. In Section 2, we introduce the experimental progress on the enhancement of thermal conductivity by aligning polymer chains, and then review the methods to further tune the thermal conductivity by engineering chain structure and inter-chain coupling, as illustrated in Fig. 3(a). In Section 3, we discuss the thermal conductivity of polymer nanocomposites both with and without inter...

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“…The in-plane thermal conductivity of the composite paper at 5 wt% h-BN loading can reach 26.2 W/mK [34]. We also prepared graphene oxide/polyvinyl alcohols composite with an in-plane thermal conductivity of 17.61 W/mK at only 0.1 wt% graphene oxide (GO) loading [35].…”

Section: Introductionmentioning

confidence: 99%

Boron nitride nanoplatelets as two-dimensional thermal fillers in epoxy composites: new scenarios at very low filler loadings

Shi

Lin

et al. 2020

Journal of Polymer Engineering

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Hexagonal boron nitride (h-BN) nanoplatelets (0.6 μm in diameter and 100 nm in thickness) are introduced into epoxy resin to improve the polymer’s thermal conducting ability. As expected, the thermal conductivities (TCs) of the composites, especially the in-plane TCs, are significantly increased. The in-plane TC of the epoxy composites can reach 1.67 W/mK at only 0.53 wt% loading, indicating h-BN nanopletelets are very effective thermal fillers. However, after carefully studied the correlation of the TC improvement and filler content, a sudden drop of the TC around 0.53 wt% filler loading is observed. Such an unexpected decrease in TC has never been reported and is also found to be consistent with the Tg changes versus filler content. Similar trend is also observed in other 2-D nanofillers, such as graphene oxide, reduced graphene oxide, which may indicate it is a general phenomenon for 2-D nanofillers. SEM results suggest that such sudden drop in TC might be coming from the enrichment of these 2-D nanofillers in localized areas due to their tendency to form more ordered phase above certain concentrations.

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Aligned Graphene Oxide Nanofillers: An Approach to Prepare Highly Thermally Conductive and Electrically Insulative Transparent Polymer Composites

Cited by 10 publications

References 17 publications

Properties of polyaniline/graphene oxide (PANI/GO) composites: effect of GO loading

Properties of polyaniline/graphene oxide (PANI/GO) composites: effect of GO loading

Thermal conductivity of polymers and polymer nanocomposites

Boron nitride nanoplatelets as two-dimensional thermal fillers in epoxy composites: new scenarios at very low filler loadings

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