Alignment-Insensitive Coupling for PLC-Based Surface Mount Photonics

Vernooy, D. W.; Paslaski, J.; Blauvelt, H.; Lee, R.B.; Vahala, Kerry J.

doi:10.1109/lpt.2003.819392

Cited by 14 publications

(2 citation statements)

References 9 publications

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“…Adiabatic transitions from on-chip to off-chip waveguides have been previously investigated for silicon nitride optical jumpers [16]. We also became aware of the design of an SU8 to silicon adiabatic transition [17] for board to chip coupling after we performed the current work.…”

Section: Transition From Polymer To Nanophotonic Waveguidementioning

confidence: 98%

Low-Cost Interfacing of Fibers to Nanophotonic Waveguides: Design for Fabrication and Assembly Tolerances

Barwicz

Taira

2014

IEEE Photonics J.

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The high cost and low scalability of interfacing standard optical fibers to nanophotonic waveguides hinder the deployment of silicon photonics. We propose a mechanically compliant low-cost interface with integrated polymer waveguides. Our concept promises better mechanical reliability than a direct fiber-to-chip coupling and a dramatically larger bandwidth than diffractive couplers. Our computations show a 0.1-dB penalty over a 200-nm bandwidth, whereas typical two-polarization vertical couplers show a $1-dB penalty over a 30-nm bandwidth. In this paper, we present a comprehensive analysis of the design space using optimization routines to achieve a fabrication-and assembly-tolerant design. We demonstrate the concept feasibility through extensive tolerance analysis with parameter control assumptions derived from low-cost manufacturing.

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Section: Transition From Polymer To Nanophotonic Waveguidementioning

confidence: 98%

Low-Cost Interfacing of Fibers to Nanophotonic Waveguides: Design for Fabrication and Assembly Tolerances

Barwicz

Taira

2014

IEEE Photonics J.

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“…Hybrid integration of InGaAsP/InP sources and silica fibers using passive alignment silicon waferboard is suggested and demonstrated for producing optical communication modules [4], [5]. Research work has led to the demonstration and utilization of planar lightwave circuits (PLCs) [6]- [8]. However, hybrid integration also seems to offer a very competitive solution for optical communication modules [9]- [11].…”

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confidence: 99%

Fiber Pigtailed Multimode Laser Module Based on Passive Device Alignment on an LTCC Substrate

Keränen

Mäkinen

Kautio

et al. 2006

IEEE Trans. Adv. Packag.

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A concept that utilizes structured planar substrates based on low-temperature cofired ceramics (LTCC) as a precision platform for a miniature passive alignment multimode laser module is demonstrated. The three-dimensional shape of the laminated and fired ceramic substrate provides the necessary alignment structures including holes, grooves, and cavities for the laser-to-fiber coupling. The achieved passive alignment accuracy allows high coupling efficiency realizations of multimode fiber pigtailed laser modules. Thick-film printing and via punching can be incorporated in order to integrate electronic assemblies directly on the optomechanical platform. The platform is scalable, and it allows embedding of subsystems, such as silicon optical bench (SiOB), but it also provides the interface for larger optical systems. Temperature management of high-power laser diodes is achieved by realizing heat dissipation structures and a cooling channel into the LTCC substrate. The measured maximum laser metallization temperature was 70 C when a thermal power of 0.5 W was applied at the laser active area using a liquid cooling of 50 mL/min. The measured maximum temperature of the laser surface was about three times higher without liquid cooling. Optical coupling efficiency of the multimode laser systems was simulated using optical systems simulation software. The nominal coupling efficiency between 100 1 m stripe laser and 62.5/125-m graded index fiber (NA = 0.275) was 0.37. The simulated coupling efficiency and alignment tolerances were verified by prototype realization and characterization. The measured alignment tolerance values between laser and fiber in AT prototype series were 1 = 7.7 m, 1 = 7.6 m, and 1 = 10.8 m (SD values). The corresponding values in A2 prototype series were 1 = 3.1 m, 1 = 9.1 m, and 1 = 10.2 m. The measured average coupling efficiency was 0.28 in AT series and 0.31 in A2 series. The coupling efficiencies of all operational prototypes varied from 0.05 to 0.43.

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Fiber-based broadband access technology and deployment

Wagner

2008

Optical Fiber Telecommunications v B

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Alignment-Insensitive Coupling for PLC-Based Surface Mount Photonics

Cited by 14 publications

References 9 publications

Low-Cost Interfacing of Fibers to Nanophotonic Waveguides: Design for Fabrication and Assembly Tolerances

Low-Cost Interfacing of Fibers to Nanophotonic Waveguides: Design for Fabrication and Assembly Tolerances

Fiber Pigtailed Multimode Laser Module Based on Passive Device Alignment on an LTCC Substrate

Fiber-based broadband access technology and deployment

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