1999
DOI: 10.1016/s0040-6090(98)01510-7
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Alkali metal promoted oxidation of the Si(113) surface

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Cited by 4 publications
(2 citation statements)
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“…In general, an ultrathin SiO 2 films (≤ 1 nm) was formed on the silicon substrate that the silicon/SiO 2 interface becomes crucial for good transistor behavior. Several fabrication methods have been employed for the formed of ultrathin SiO 2 films, such as rapid thermal oxidation (RTO) [36], oxidation with excited molecules and ions [37,38], plasma oxidation [39,40], photo-oxidation [34,41], ozone oxidation [43], metal-promoted oxidation [44], anodic oxidation [45,46] and nitric acid (HNO 3 ) vapor oxidation [47,48] etc. When a reverse bias is applied to a MOS photodiode, the energy bands in the semiconductor bend and a potential well is formed between the oxide and the semiconductor.…”
Section: Ultrathin Sio 2 Filmsmentioning
confidence: 99%
“…In general, an ultrathin SiO 2 films (≤ 1 nm) was formed on the silicon substrate that the silicon/SiO 2 interface becomes crucial for good transistor behavior. Several fabrication methods have been employed for the formed of ultrathin SiO 2 films, such as rapid thermal oxidation (RTO) [36], oxidation with excited molecules and ions [37,38], plasma oxidation [39,40], photo-oxidation [34,41], ozone oxidation [43], metal-promoted oxidation [44], anodic oxidation [45,46] and nitric acid (HNO 3 ) vapor oxidation [47,48] etc. When a reverse bias is applied to a MOS photodiode, the energy bands in the semiconductor bend and a potential well is formed between the oxide and the semiconductor.…”
Section: Ultrathin Sio 2 Filmsmentioning
confidence: 99%
“…The thermal oxidation method always involves high processing temperatures ( 800 • C), which induces stress due to the difference between the oxidation temperature and the device operational temperature. This disadvantage can be avoided by employing low temperature formation methods such as oxidation with excited molecules and ions [14][15][16], plasma oxidation [17,18], photooxidation [19], ozone oxidation [20,21], metal-promoted oxidation [22,23] and anodic oxidation [24,25]. Using these methods, however, the leakage current density of the SiO 2 /Si structure is higher than that produced by conventional thermal oxidation.…”
Section: Introductionmentioning
confidence: 99%