Alkylbenzene‐Maleic anhydride photoadducts as dianhydrides for epoxies and polyimides

Abstract

swornDianhydrides from ethylbenzene, cumene, and branched C&S alkylbenzene-maleic anhydride photoadducts have a surprisingly high solubility in epoxy resins. Dianhydrides from benzene, toluene, and n-Clo-C1a alkylbenzene adducts, which are homologs of the above, were not soluble. Epoxies cured with the ethylbenzene and cumene dianhydride adducts had higher heat distortion temperatures and flexural strengths than epoxies cured with two commercial monoanhydrides. High-melting polyimides were also obtained with these two new dianhydrides.