“…The bottom-up approach employed by Fonseca and co. [13][14][15] tackles contact, embedding and scalability issues, allowing growth and integration of dense arrays of suspended NWs in arbitrarily deep micro-trenches of thermoelectric devices in a single CVD step. Moreover, these devices are able to naturally set up a temperature difference across the NWs when placed on top of hot surfaces exposed to air, generating useful power from waste heat [16,17], while results often reported in literature for micro-TEG devices usually force a temperature difference with a heater, making difficult to ascertain an enhanced thermal performance [10,11,15,18].…”