Alloy design of Zn–Al–Cu solder for ultra high temperatures

Effect of Cu Addition to Zn-12Al Alloy on Thermal Properties and Wettability on Cu and Al Substrates

“…However, in the present case, the electrical resistivity and CTE increased with the Cu concentration, which is interpreted as Cu failing to dissolve in the ZnAl matrix and Cu-Zn intermetallic phases forming instead. Kang et al [12] observed a similar effect of increased electrical resistivity with the addition of Cu in alloys. The Zn-Al-Cu solder exhibited an electrical resistivity of 5.5 to 7.0 lX cm at room temperature, which was lower than that of the Sn-37Pb solder (14.25 lX cm [18] ).…”

“…[8,9] The major contribution of the Vianco team, [10] which worked on alloys in the temperature range above 573 K (300°C), is noteworthy. Yet their new ecological alloys still did not yield very good results, so further research has been conducted by Takaku, [11] Kang, [12] and Savaskan, [13] to improve the alloy properties. The proposed eutectic ZnAl alloys have a higher melting point, of 654 K (381°C), after the addition of Cu, and they demonstrate good corrosion resistance and high mechanical strength.…”

“…[8][9][10] The intermetallic phases (IMPs) in the Cu-Zn system have a very important role in the joining of metals. [11][12][13][14] Therefore, the formation of IMP layers on a Cu substrate has a significant impact on the properties of the joints.…”

Wetting of Cu and Al by Sn-Zn and Zn-Al Eutectic Alloys

“…Sn-Ag, Sn-Ag-Cu, and multicomponent alloys based on them were broadly studied (Ref 5,6) and have already used been commercially. On the other hand, data for Zn-Al alloys seem fragmentary, and they do not contain details regarding wettability (Ref 7,8).…”

Physicochemical Properties of Sb-Sn-Zn Alloys

“…The main trend of research is to find replacements for lead solder with low-and hightemperature properties similar to those of toxic solders containing Pb and Cd, which are characterized by melting points above 473 K and 623 K, respectively, for use in different types of connections, not only as solder alloys for pressure soldering, but also for installation of optical components in industries such as automotive, aerospace, electronics, etc. 4 Eutectic Sn-Zn alloys [5][6][7][8] form the second most interesting group of metallic materials for use in the electronics industry, the first being the triple eutectic Ag-Sn-Cu (SAC) alloys. [9][10][11] The most frequently used solder modifiers for Sn-Zn eutectic are bismuth, indium, and antimony.…”