Alternate PCM with air cavities in LED heat sink for transient thermal management

Abstract

Purpose The purpose of this paper is to optimize the configuration of a heat sink with phase change material for improving the cooling performance of light emitting diodes (LED). Design/methodology/approach A numerical three-dimensional time-dependent model is developed with COMSOL Multiphysics to simulate the phase change material melting process during both the charging and discharging period. Findings The model is validated with previously published works. It found a good agreement. The difference between filled cavities with phase change materials (PCM) and alternate cavities air-PCM is discussed. The last-mentioned showed a good ability for reducing the junction temperature during the melting time. Three cases of this configuration having the same total volume of PCM but a different number of cavities are compared. The case of ten fins with five PCM cavities is preferred because it permit a reduction of 21 per cent of the junction temperature with an enhancement ratio of 2:4. The performance of this case under different power input is verified. Originality/value The use of alternate air-PCM cavities of the heat sink. The use of PCM in LED to delay the peak temperature in the case of thermal shock (for example, damage of fan) An amount of energy is stored in the LED and it is evacuated to the ambient of the accommodation by the cycle of charging and discharging established (1,765 Joule stored and released each 13 min with 1 LED chip of 5 W).

Optimization of fins arrangements for the square light emitting diode (LED) cooling through nanofluid-filled microchannel

“…So, due to this advantages of LED lamps, many researchers focused on its improvements and optimizations. For instance, Ben Salah and Ben Hamida 5 , 6 investigated the heat transfer in LED geometries using air and PCM as alternative cooling materials. They also compared the results based on Ha and Graham 7 study for a chip-on-board packing of LED arrays with high power.…”

Numerical simulation and microchannels parameters optimization for thermal management of GaN HEMT devices

“…Width of microchannels (W) and number of microchannels (N) are selected as the design variables. The number of microchannels is in the range of 5-9 which is a typical value Thermal management of GaN HEMT devices for half region in microchannel-cooling (Xia et al, 2019;Ben Salah and Ben Hamida, 2019). Correspondingly, the width of microchannels (W) is given in the range of 10-24 um with an interval of 2 um.…”

Significance of exponential space‐based heat source and inclined magnetic field on heat transfer of hybrid nanoliquid with homogeneous–heterogeneous chemical reactions

“…Siddiqa et al 8 studied the micropolar fluid along a vertical sheet. Salah et al 9 studied the alternate phase change material (PCM) with air cavities in the LED heat sink for transient thermal management.…”