This report is the second series of 157nm alternating phase shifting mask done at ISMT. In this report, we present a comprehensive study of balancing aerial image through various feature sizes and pitches. New results of resist images are analyzed from a 157-nm alternating PSM with a 0.85 NA lens. The mask is made by dual trench technique with a phase-etch of 115nm and an isotropic under-etch of 90nm based on optimized simulation results. With this dual trenched mask, the wafer printing images show tremendous improvement on "line paring" phenomena. We also present more detailed study on abnormal CD variation across line array observed during this investigation. The results from this work give an initial assessment of 157-nm capability of alternating PSM and 157-nm resist imaging quality.