Ambient Electronics

Sekitani, Tsuyoshi; Someya, Takao

doi:10.1143/jjap.51.100001

Cited by 26 publications

(20 citation statements)

References 92 publications

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“…For such future applications, electronics should be cost‐effective, environmentally friendly, disposable/recyclable, light‐weight, unbreakable, and easy to carry: printed and flexible (or stretchable) devices can satisfy these requirements. Flexible radio‐frequency identification (RFID) tags, near‐field communication (NFC) devices, ambient electronics, and portable flexible displays are some examples of such ubiquitous electronic applications that can be realized within the near future 2. Recently, a few pioneering companies have successfully demonstrated the first example of these flexible RFID tags and active matrix flexible displays 3–6…”

Section: Introductionmentioning

confidence: 99%

Toward Printed Integrated Circuits based on Unipolar or Ambipolar Polymer Semiconductors

2013

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For at least the past ten years printed electronics has promised to revolutionize our daily life by making cost-effective electronic circuits and sensors available through mass production techniques, for their ubiquitous applications in wearable components, rollable and conformable devices, and point-of-care applications. While passive components, such as conductors, resistors and capacitors, had already been fabricated by printing techniques at industrial scale, printing processes have been struggling to meet the requirements for mass-produced electronics and optoelectronics applications despite their great potential. In the case of logic integrated circuits (ICs), which constitute the focus of this Progress Report, the main limitations have been represented by the need of suitable functional inks, mainly high-mobility printable semiconductors and low sintering temperature conducting inks, and evoluted printing tools capable of higher resolution, registration and uniformity than needed in the conventional graphic arts printing sector. Solution-processable polymeric semiconductors are the best candidates to fulfill the requirements for printed logic ICs on flexible substrates, due to their superior processability, ease of tuning of their rheology parameters, and mechanical properties. One of the strongest limitations has been mainly represented by the low charge carrier mobility (μ) achievable with polymeric, organic field-effect transistors (OFETs). However, recently unprecedented values of μ ∼ 10 cm(2) /Vs have been achieved with solution-processed polymer based OFETs, a value competing with mobilities reported in organic single-crystals and exceeding the performances enabled by amorphous silicon (a-Si). Interestingly these values were achieved thanks to the design and synthesis of donor-acceptor copolymers, showing limited degree of order when processed in thin films and therefore fostering further studies on the reason leading to such improved charge transport properties. Among this class of materials, various polymers can show well balanced electrons and holes mobility, therefore being indicated as ambipolar semiconductors, good environmental stability, and a small band-gap, which simplifies the tuning of charge injection. This opened up the possibility of taking advantage of the superior performances offered by complementary "CMOS-like" logic for the design of digital ICs, easing the scaling down of critical geometrical features, and achieving higher complexity from robust single gates (e.g., inverters) and test circuits (e.g., ring oscillators) to more complete circuits. Here, we review the recent progress in the development of printed ICs based on polymeric semiconductors suitable for large-volume micro- and nano-electronics applications. Particular attention is paid to the strategies proposed in the literature to design and synthesize high mobility polymers and to develop suitable printing tools and techniques to allow for improved patterning capability required for the down-scaling of devices in order t...

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Section: Introductionmentioning

confidence: 99%

Toward Printed Integrated Circuits based on Unipolar or Ambipolar Polymer Semiconductors

2013

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“…Printed electronics is an emerging fi eld that is expected to reach a market value of several hundred billion dollars. [152][153][154][155] Several different considerations motivate the development of this industry: i) There is strong interest in unusual forms of electronics devices that can be worn or integrated with the human body; these require fabrication approaches that are compatible with fl exible/stretchable substrates and curved or structured surfaces; ii) some active materials (i.e., organic semiconductors, biomaterials for sensing) are chemically, mechanically, or thermally incompatible with traditional approaches from the existing semiconductor industry, such as photolithography; iii) there is a need for low-cost and environmentally friendly fabrication of electronic devices where the material usage is minimal. Ink-jet printing technology represents a leading fabrication approach for this area, and is already used by several companies.…”

Section: Printed Electronicsmentioning

confidence: 99%

Mechanisms, Capabilities, and Applications of High‐Resolution Electrohydrodynamic Jet Printing

Önses

Sutanto

Ferreira

et al. 2015

Small

504

397

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This review gives an overview of techniques used for high-resolution jet printing that rely on electrohydrodynamically induced flows. Such methods enable the direct, additive patterning of materials with a resolution that can extend below 100 nm to provide unique opportunities not only in scientific studies but also in a range of applications that includes printed electronics, tissue engineering, and photonic and plasmonic devices. Following a brief historical perspective, this review presents descriptions of the underlying processes involved in the formation of liquid cones and jets to establish critical factors in the printing process. Different printing systems that share similar principles are then described, along with key advances that have been made in the last decade. Capabilities in terms of printable materials and levels of resolution are reviewed, with a strong emphasis on areas of potential application.

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“…Memory based on organic field-effect transistor (OFET) has received considerable attention due to its advantages such as mechanical flexibility, low-cost, and suitability for large-area fabrication [1,2]. The memory OFET could be obtained by using a ferroelectric material as the gate dielectric layer.…”

Section: Introductionmentioning

confidence: 99%

Electron trapping mechanism in a multi-level organic fet memory using lithium-ion-encapsulated fullerene as the floating gate

Manh

2019

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We report on the electron trapping mechanism in a multi-level organic field effect transistor (OFET) memory using Lithium-ion-encapsulated fullerene (Li + @C60) as the floating gate. Based on the estimation of trapped electron number per each Li + @C60 molecule when a programming voltage was applied, the active domain of the floating gate was determined to be the surface of the Li + @C60 domain. An analysis of the cyclic voltammetry indicated that each Li + @C60 molecule can trap electrons at the trapping energy level of -4.94 and -4.49 eV. The number of trapped electron was confirmed by the ultraviolet-visible spectroscopy (UV-Vis).

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Ambient Electronics

Abstract: We report the recent research progress and future prospects of flexible and printed electronics, focusing on molecular electronic material-based thin-film transistors, which are expected to usher in a new era of electronics.

Cited by 26 publications

References 92 publications

Toward Printed Integrated Circuits based on Unipolar or Ambipolar Polymer Semiconductors

Toward Printed Integrated Circuits based on Unipolar or Ambipolar Polymer Semiconductors

Mechanisms, Capabilities, and Applications of High‐Resolution Electrohydrodynamic Jet Printing

Electron trapping mechanism in a multi-level organic fet memory using lithium-ion-encapsulated fullerene as the floating gate

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