Intrinsic and n-type Ge1–y
Sn
y
alloys with y = 0.003–0.11
have been grown on
Ge-buffered Si via reactions of Ge3H8 and SnD4 hydrides using UHV-CVD techniques. The films exhibit large
thicknesses (t > 600 nm), low dislocation densities
(107/cm2), planar surfaces (AFM RMS ≈
2 for intrinsic films) and mostly relaxed microstructures, making
them suitable for subsequent characterization of the emission properties
using photoluminescence (PL) spectroscopy. The PL spectra are acquired
at room temperature and show tunable and distinct direct and indirect
gap emission peaks versus composition. The peak intensity in a given
sample is found to increase by exposing the layers to hydrogen plasma,
indicating that surface passivation plays an important role in eliminating
carrier recombination traps. The PL intensity is further increased
by n-type doping with P/As atoms at levels 0.8–7
× 1019 cm–3using P(GeH3)3, P(SiH3)3, and As(SiH3)3 precursors, indicating that desirable direct gap conditions
can be approached even at relatively modest 6–8% Sn contents.
The indirect and direct gap energies of the samples are then used
to determine the direct gap cross over point at ∼9% Sn. Collectively
the results in this paper show that strong light emission can be generated
in this class of narrow gap alloys by adjusting the Sn content, subjecting
the samples to post growth passivation treatments or doping the system n-type. The influence of precursor chemistry on the activation
properties and optical behavior of the materials is explored with
the objective to optimize the PL response near the indirect–direct
gap threshold. New methods embodying environmentally safe conditions
are designed to produce the dopant compounds in high purity for application
in future generation working devices requiring enhanced IR optical
performance.