Ambient Use-Condition Models for Reliability Assessment

Gu, Chen; Kwasnick, R. F.; Mielke, N.; Monroe, Eric M.; Shirley, C. G.

doi:10.1109/relphy.2006.251232

Cited by 9 publications

(5 citation statements)

References 6 publications

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“…The on and off states of the products are not considered separately. A different approach was used [5], however, we expect the effect of the on-state will be insignificant for the results in this case. This product was used in a car, so the on-state is about 1.5 hours per day, and the rest of time is in off state.…”

Section: B Environmenal Load Dependent Casementioning

confidence: 98%

“…Semiconductor component (product) mission profiles are often obtained by taking the mission profiles from electronic module applications and by translating them to the component level. For example, ambient temperature and relative humidity mission profiles can be obtained from climatic data [5]. The junction temperature mission profile of the component is then derived by taking into account the operating time, power dissipation and thermal conductivity to the module board.…”

Section: Introductionmentioning

confidence: 99%

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Mission Profiles derived from lifetests and field return data using inverse problem theory

Liang

Kho

2014

2014 IEEE International Reliability Physics Symposium

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Mission Profiles are keys to set reliability requirements. This paper describes a method of Mission Profile deduction from reliability stresses and field return data, using inverse problem theory. This method has been applied to two cases. From the first case (operating-load-case) we can obtain a temperature mission profile and from the second case (environmental-load-case) we have derived temperature and relative humidity mission profiles. The method can be used for more accurate failure rate prediction in the field and lead to more reliable risk assessment.

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Section: B Environmenal Load Dependent Casementioning

confidence: 98%

Section: Introductionmentioning

confidence: 99%

Mission Profiles derived from lifetests and field return data using inverse problem theory

Liang

Kho

2014

2014 IEEE International Reliability Physics Symposium

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“…Such temperature swings could be a result of ambient condition changes (daily or seasonal changes) or product use cases which are application specific. [ 25 ] Changes in temperature can result in material expanding and contracting. In the case of a gallium‐based interconnect system, the conductors (pads or the socket pins) can move relative to each other.…”

Section: Review Of Gallium‐based Reliability Riskmentioning

confidence: 99%

Field Risk Evaluation of Liquid Metal Interconnects in Microelectronics Applications

Meyyappan,

Murtagian,

Tadayon

et al. 2023

Adv Eng Mater

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Gallium is one of the most desirable, yet less known, interconnects considered in the semiconductor industry. Good electrical conductivity and high stretchability of the liquid metal makes it very attractive for many applications. It allows components to be assembled or disaggregated like Lego blocks without any external forces or energy. The focus of this paper is to shed light on intrinsic reliability degradation mechanisms for components that use liquid metal interconnects. As a starting reference to field reliability risk evaluations, the authors focus on common/controlled use conditions. Environments studied include standard test evaluation procedures like thermal aging (sustained exposure to high temperature over time), thermal cycling, current carrying capability and finally functional product life cycle testing. Studies reveal that the interconnect has very distinct failure mechanisms and unique advantageous/disadvantageous over existing interconnects. Fundamental knowledge gained in this study is expected to help 1) drive future architectures, 2) material/design changes to address any limitations and 3) lastly new qualification methods/standards that account for the unique failure mechanisms.This article is protected by copyright. All rights reserved.

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“…The hot carrier lifetime for the op-amp was simulated and calculated based on the thermal profile rather than assuming a worst-case constant operating temperature to address the varying operating condition [8][9].…”

Section: ) Design For Performancementioning

confidence: 99%

A motor drive electronics assembly for Mars Curiosity Rover: An example of assembly qualification for extreme environments

Kolawa

Chen

Mojarradi

et al. 2013

2013 IEEE International Reliability Physics Symposium (IRPS)

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-This paper describes the technology development and infusion of a motor drive electronics assembly for Mars Curiosity Rover under space extreme environments. The technology evaluation and qualification as well as space qualification of the assembly are detailed and summarized. Because of the uncertainty of the technologies operating under the extreme space environments and that a high level reliability was required for this assembly application, both component and assembly board level qualifications were performed.

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Ambient Use-Condition Models for Reliability Assessment

Cited by 9 publications

References 6 publications

Mission Profiles derived from lifetests and field return data using inverse problem theory

Mission Profiles derived from lifetests and field return data using inverse problem theory

Field Risk Evaluation of Liquid Metal Interconnects in Microelectronics Applications

A motor drive electronics assembly for Mars Curiosity Rover: An example of assembly qualification for extreme environments

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