Design, Automation &Amp; Test in Europe Conference &Amp; Exhibition (DATE), 2014 2014
DOI: 10.7873/date2014.223
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Ambient variation-tolerant and inter components aware thermal management for mobile system on chips

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Cited by 11 publications
(18 citation statements)
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“…To describe the thermal interaction between the hardware components of the mobile devices, Ferroni et al [14] implemented a thermal prediction tool using a linear relationship between temperature difference and physical distance among hardware components. Paterna et al [15] proposed an exponential thermal prediction method considering the ambient condition and thermal coupling between mobile AP and the WiFi chipset. These more practical thermal prediction methods are less accurate due to their oversimplified thermal models.…”
Section: Thermal Prediction Methods For Mobile Devicesmentioning
confidence: 99%
See 1 more Smart Citation
“…To describe the thermal interaction between the hardware components of the mobile devices, Ferroni et al [14] implemented a thermal prediction tool using a linear relationship between temperature difference and physical distance among hardware components. Paterna et al [15] proposed an exponential thermal prediction method considering the ambient condition and thermal coupling between mobile AP and the WiFi chipset. These more practical thermal prediction methods are less accurate due to their oversimplified thermal models.…”
Section: Thermal Prediction Methods For Mobile Devicesmentioning
confidence: 99%
“…To protect microprocessors from thermal violations, there have been many studies on thermal prediction-based DTM (Dynamic Thermal Management) [6][7][8][9][10][11][12][13][14][15][16] to predict the temperature and then to lower the resource usage if the predicted temperature is at risk of exceeding the thermal threshold. Since those studies consider rapid temperature increases as abnormal and rare cases, they use simple solutions despite the risk of thermal violations.…”
Section: Introductionmentioning
confidence: 99%
“…However, few publications target thermal management for mobile devices. In Reference [11] the authors presents a thermal model of a mobile system and use it to develop a thermal management strategy. The thermal model presented in [23] focuses on the thermal interaction with the battery subsystem.…”
Section: Related Workmentioning
confidence: 99%
“…Thermal management is a very actively researched area, spanning from high performance multi-clusters to mobile devices [1], [11], [12]. Thermal management can be broadly classified into reactive, if decisions are based on current or past temperature, or proactive, if decisions are based on predicted future temperature.…”
Section: Introductionmentioning
confidence: 99%
“…Different devices have different ergonomic limits and usage times, from seconds for phones to minutes for tablets. These thermally aware systems contain several sensors for predictive temperature control, e.g., by throttling performance [57]. Internal heat conduction and capacitance is optimized using TIM layers, but the layout remains a challenge for architectures with memory on top of a CPU, resulting in a restricted thermal pathway to the outside.…”
Section: B) Challenges Related To System Designmentioning
confidence: 99%