2019
DOI: 10.1039/c9tc03933c
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Amorphous InGaZnO and metal oxide semiconductor devices: an overview and current status

Abstract: This review covers the history, development, and state of the art, of metal oxide-based electronics, with particularly focus of indium-gallium-zinc-oxide.

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Cited by 109 publications
(80 citation statements)
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References 330 publications
(330 reference statements)
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“…350,351 Amorphous indium gallium zinc oxide (a-IGZO) is one of the most successful commercialized oxide semiconductors in this century, widely used in thin-film transistors (TFTs) for high-resolution displays. 298,[352][353][354][355] Defects have a significant influence on a-IGZO materials and TFTs, i.e., while most defects are detrimental to device performance, some defects actually play a positive role in improving carrier density. 304,356,357 V O , metal-metal bonds and H incorporation are the three main defect types present in channel region of a-IGZO TFTs.…”
Section: Wide Bandgap Oxide Semiconductorsmentioning
confidence: 99%
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“…350,351 Amorphous indium gallium zinc oxide (a-IGZO) is one of the most successful commercialized oxide semiconductors in this century, widely used in thin-film transistors (TFTs) for high-resolution displays. 298,[352][353][354][355] Defects have a significant influence on a-IGZO materials and TFTs, i.e., while most defects are detrimental to device performance, some defects actually play a positive role in improving carrier density. 304,356,357 V O , metal-metal bonds and H incorporation are the three main defect types present in channel region of a-IGZO TFTs.…”
Section: Wide Bandgap Oxide Semiconductorsmentioning
confidence: 99%
“…368,369 The metal-metal bonds are associated to V O , formed by the binding of uncoordinated metal ions caused by deficient oxygen to eliminate the dangling bonds. 355 Additional sub-gap states are induced near CBM by metal-metal bonds and could significantly increase the off-state leakage current I off . 356,370,371 Reduction of metal-metal bonds generally follows the path with the decrease of V O , yet they are harder to eliminate for the additional energy required to break the bonds.…”
Section: Wide Bandgap Oxide Semiconductorsmentioning
confidence: 99%
“…N‐type amorphous IGCO TFTs with a bottom‐gate staggered structure (as shown in Figure a, a conventional structure that is commonly used in the ubiquitous active matrix display) were fabricated on 100 nm thermally growth SiO 2 /Si substrates. A 40 nm‐thick IGCO semiconductor channel patterned by a metal mask was deposited at room temperature via radio frequency sputtering an IGCO ceramic target (In:Ga:Cd = 1:1:1) at a working power of 60 W along with an Ar/O 2 flow of 6/0.03 sccm.…”
mentioning
confidence: 99%
“…This meets the requirements of low temperature preparation in the field of flexible display. In 2 O 3 has been widely studied in the preparation of TFT active layer due to its wide band gap, high mobility, high carrier concentration and good transparency [ 1 , 28 , 29 , 30 , 31 ], but there is still little research on the influence mechanism of amorphous In 2 O 3 electrical stability [ 32 ].…”
Section: Introductionmentioning
confidence: 99%