2009 IEEE Energy Conversion Congress and Exposition 2009
DOI: 10.1109/ecce.2009.5316113
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“Black box” EMC model for power electronics converter

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Cited by 43 publications
(35 citation statements)
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“…Most of modern loads include more than one Power Electronics Converters (DC, AC…) [1], [2]. Since the power converters connected to the grid are excellent Electromagnetic Interference "EMI" generators, it is then necessary to study the global network behavior, including more than one converter, with respect to those ELM disturbances and then synthesize the adequate analytical models.…”
Section: The Context Of the Studymentioning
confidence: 99%
See 1 more Smart Citation
“…Most of modern loads include more than one Power Electronics Converters (DC, AC…) [1], [2]. Since the power converters connected to the grid are excellent Electromagnetic Interference "EMI" generators, it is then necessary to study the global network behavior, including more than one converter, with respect to those ELM disturbances and then synthesize the adequate analytical models.…”
Section: The Context Of the Studymentioning
confidence: 99%
“…Power converters are more and more integrated in electrical grids, particularly in embedded networks where managing input and output power forms are crucial [1]. For instance, Boeing ascertains that the electrical architecture on 787 is more power lossless than an equivalent pneumatic system [2], which illustrates how important is the "power by wire" concept.…”
Section: Introductionmentioning
confidence: 99%
“…Here, we propose an IR black-box modelling method based on [9]. The proposed method uses 2 PCB boards with the same uC but with different external components to estimate IntZ/IntCA.…”
Section: Ir Solution Deductionmentioning
confidence: 99%
“…This paper proposes a black-box [9] method and tries to resolve the problem. The idea is based on impulse response (IR) function estimation by 2 testing boards.…”
Section: Introductionmentioning
confidence: 99%
“…Traces on the board contribute a larger measured impact than the device under test [16]. The SMA connector, trace, and PCB board that cause the impedance effects that were eliminated by the deembedding method are shown in Figure 3.…”
Section: Deembeddingmentioning
confidence: 99%