Amphiphilic block co-polymer and silica reinforced epoxy composite with excellent toughness and delamination resistance for durable electronic packaging application

Lee, Minkyu; Paria, Sarbaranjan; Mondal, Subhadip; Lee, Gi-Bbeum; Shin, Beomsu; Kim, Suhyun; Park, Sungjune; Nah, Changwoon

doi:10.1016/j.polymer.2022.124679

Cited by 16 publications

(14 citation statements)

References 66 publications

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“…If heat cannot be exported in time and accumulated too much, it will raise the temperature of integrated circuits and chips, affect their work, and even burn electronic components. 98…”

Section: Applications Of Tceipcsmentioning

confidence: 99%

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Research advances in preparation, mechanism and application of thermally conductive and electrically insulating polymer composites in thermal management materials: A review

Wang

2023

High Performance Polymers

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Today, electronic components are gradually developing towards miniaturization and multi-function. During the use of electronic components, a large amount of heat will be generated, which seriously limits the performance and service life of electronic components. Therefore, the preparation of thermal management material (TMMs) with high thermal conductivity (λ) can effectively solve the problem of thermal accumulation in electronic components. Compared with the preparation of intrinsic thermal conductive polymer composite, the method of filling thermal conductive filler in polymer matrix can better improve the λ of polymer composite. This review discusses the heat conduction mechanism of polymer and the factors affecting λ of polymer composites, including the type of filler, the shape and distribution of filler, and the functional surface treatment of filler. Then, the different methods of preparing thermally conductive and electrically insulating polymer composites (TCEIPCs) are introduced in detail. The application of polymer composites in thermal management is also introduced.

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“…If heat cannot be exported in time and accumulated too much, it will raise the temperature of integrated circuits and chips, affect their work, and even burn electronic components. 98…”

Section: Applications Of Tceipcsmentioning

confidence: 99%

“…In recent years, the application proportion of TCEIPCs in the field of packaging is increasing, and gradually replace the traditional ceramic packaging materials. 98,99…”

Section: Applications Of Tceipcsmentioning

confidence: 99%

Research advances in preparation, mechanism and application of thermally conductive and electrically insulating polymer composites in thermal management materials: A review

Wang

2023

High Performance Polymers

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“…34 Lots of microcracks and shear bands appear in the sections of composites upon loading; instead of passing through matrix, the cracks avoid the particles and grow along the edge of the particles in a new direction, showing the characteristics of ductile fracture, dissipating energy in various direction and thus improving toughness. 35 In the stress concentration region, the dispersed rubber particles act as the initial shear deformation zone. When the shear bands caused by the two particles begin to interact, the stress propagation will be terminated.…”

Section: Stress-strain Measurementmentioning

confidence: 99%

Evaluation ofbisphenol‐Aepoxy cured with diethylenetriamine by using phosphorus containing liquid poly(1,2‐butadiene) as multifunctional additives

Wang

Guo

2022

J of Applied Polymer Sci

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Phosphorus containing liquid epoxidate polybutadiene (P‐LEPB) is synthesized and used as the additive to improve the flame retardancy and toughness of epoxy resin (EP). The structure of P‐LEPB is confirmed by Fourier transform infrared (FTIR), 1H and 13C nuclear magnetic resonance (NMR). With the addition of P‐LEPB, EP composites show earlier degradation; and P‐LEPB plays flame retardancy functions as reflected by the increase of limiting oxygen index (LOI) and its promotion of carbonization as seen from the char scanning electron microscopy images after LOI tests. The addition of P‐LEPB improves the water proof performance of EP composites, playing positive effect on resisting water spreading on the surface and immersing in the EP composites as supported by the water absorption rates and contact angle measurements. The elongation at break increases with addition of P‐LEPB and reaches nearly three times higher than the neat epoxy at P‐LEPB addition of 10%, the toughening effect of P‐LEPB is attributed to the diverting function by the P‐LEPB microspheres upon stress loading, which is related to the size and distribution of P‐LEPB additions as seen from their cross‐sectional images of the composites.

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“…Toughening agents such as nano-inorganics, rubbers, thermoplastic resins and core-shell particles have been reported to enhance the toughness of epoxy resins by forming phase separation in its curing network [ 7 , 8 , 9 ]. Unfortunately, although these toughening agents improve the toughness to a certain extent, other properties, such as glass transition temperature (T g ), stiffness and processability, are affected [ 10 ]. Additionally, with the advancement of technology, it has become more difficult to fulfill the demands for material production with a single aspect of performance improvement.…”

Section: Introductionmentioning

confidence: 99%

High-Branched Organosilicon Epoxy Resin with Low Viscosity, Excellent Toughness, Hydrophobicity, and Dielectric Property

Chen

et al. 2023

Molecules

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Rapidly developing technology places higher demands on materials, thus the simultaneous improvement of materials’ multiple properties is a hot research topic. In this work, a high-branched silicone epoxy resin (QSiE) was synthesized and applied to the curing system of bisphenol A epoxy resin (DGEBA) for modification investigations. When 6 wt% QSiE was added to the system, the viscosity dropped by 51.8%. The mechanical property testing results indicated that QSiE could significantly enhance the material’s toughness while preserving good rigidity. The impact strength was enhanced by 1.31 times when 6wt% of QSiE was introduced. Additionally, the silicon skeleton in QSiE has low surface energy and low polarizability, which could endow the material with good hydrophobic and dielectric properties. This work provided a new idea for the preparation of high-performance epoxy resin additives, and provided a broad prospect for cutting-edge applications of epoxy resins.

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Amphiphilic block co-polymer and silica reinforced epoxy composite with excellent toughness and delamination resistance for durable electronic packaging application

Cited by 16 publications

References 66 publications

Research advances in preparation, mechanism and application of thermally conductive and electrically insulating polymer composites in thermal management materials: A review

Research advances in preparation, mechanism and application of thermally conductive and electrically insulating polymer composites in thermal management materials: A review

Evaluation ofbisphenol‐Aepoxy cured with diethylenetriamine by using phosphorus containing liquid poly(1,2‐butadiene) as multifunctional additives

High-Branched Organosilicon Epoxy Resin with Low Viscosity, Excellent Toughness, Hydrophobicity, and Dielectric Property

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