An 80 Gb/s optical I/O interface ATM switch MCM

Abstract

SUMMARYFor extensive proliferation of multimedia communications, high-speed, large-capacity node systems are required in addition to the technologies for transmission and access systems. Although the performance of the node system has progressed along with the technical advances of LSI, the LSI interconnection is now a bottleneck due to rapid advances in technology, and consequently this bottleneck may limit the performance of the node system. One way to resolve this situation and extract the performance of the LSI at the maximum is the multichip module (MCM) technology. Using this technology, high-speed, multiply parallel signal transmission can be realized within MCM. However, the input and output of the signal to this MCM still suffers from bottlenecks in terms of connection distance, cable physical volume, transmission speed, flexibility, and antinoise properties so long as the conventional electric I/O is used. In order to resolve this interconnect bottleneck, the authors have developed an optical I/O interface ATM switch MCM in which the optical signal can directly enter and exit the MCM. This module is realized with 0.

Optoelectronic chip on film (OE‐COF) packaging technology

“…In order to handle a demand for capacity on the order of terabits per second, a processing capability exceeding 100 Gbit/s is required in the functional modules composing the system, in addition to optical networking. Hence, the introduction of optical packaging technology is indispensable [1][2][3]. In order to realize such high-speed large-capacity optical modules, bump mounting with a short connecting length and a high-density multiterminal connection capability suitable for multichip formats of LSIs and optical devices is needed, as well as an optical-electrical composite interconnection plate with high speed and high density in both optical and electrical interconnections.…”