An 850-nm common-cathode VCSEL driver with tunable energy efficiency for 45 Gbit/s data transmission without equalization

Schoeniger, David; Henker, Ronny; Ellinger, Frank

doi:10.1109/apmc.2017.8251648

Cited by 7 publications

(2 citation statements)

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“…For narrow signal emission spectra crosstalk is eliminated. Our single mode emission lasers show large optical power compared to other single mode VCSEL approaches [9] and are well suited for high-speed data transmission across multimode fibers for typical data center distances of a few hundred meters. To increase data rates across single multimode fibers wavelength division multiplexing according to the new IEEE802.3cd and cm standards is discussed.…”

Section: Emission Spectramentioning

confidence: 99%

Nanophotonics for a green internet

Bimberg

Larisch

2019

Smart Photonic and Optoelectronic Integrated Circuits XXI

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Energy efficient 200+ Gbit/s single fiber data transmission systems can be realized by wavelength multiplexing the directly modulated Vertical-Cavity Surface-Emitting Lasers (VCSELs) presented here, emitting at the four wavelengths 850 nm, 880 nm, 910 nm, and 940 nm. Large energy efficiency defined by a heat to data ratio (HBR) of only 240 fJ/bit @ 50 Gb/s is observed. Tuning the cavity photon lifetime is demonstrated to lead to an increase of the data rate in concert with a reduction of the HBR. The large linearity of our L-I-characteristics will allow easily higher order modulation rates. Our results might impact ongoing discussions of new physical layer standards for IEEE 802.3cm and 802.3cd coarse wavelength multiplexing standards across OM5 multimode fiber enabling up to 400 Gbit/s error-free transmission.

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Section: Emission Spectramentioning

confidence: 99%

Nanophotonics for a green internet

Bimberg

Larisch

2019

Smart Photonic and Optoelectronic Integrated Circuits XXI

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“…However, photonic interconnect poses many new challenges such as huge static power consumption, particularly due to the on-chip laser sources. The laser source used for optical signal generation typically has very low efficiency and are difficult to fabricate using SOI technology [100]. The micro-ring resonators used in the optical interconnect architectures needs thermal tuning as its wavelength selectivity varies with temperature.…”

Section: Comparison With Other Emerging Interconnect Technologiesmentioning

confidence: 99%

The Advances, Challenges and Future Possibilities of Millimeter-Wave Chip-to-Chip Interconnections for Multi-Chip Systems

Ganguly

Ahmed

Narde

et al. 2018

JLPEA

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With aggressive scaling of device geometries, density of manufacturing faults is expected to increase. Therefore, yield of complex Multi-Processor Systems-on-Chips (MP-SoCs) will decrease due to higher probability of manufacturing defects especially, in dies with large area. Therefore, disintegration of large SoCs into smaller chips called chiplets will improve yield and cost of complex platform-based systems. This will also provide functional flexibility, modular scalability as well as the capability to integrate heterogeneous architectures and technologies in a single unit. However, with scaling of the number of chiplets in such a system, the shared resources in the system such as the interconnection fabric and memory modules will become performance bottlenecks. Additionally, the integration of heterogeneous chiplets operating at different frequencies and voltages can be challenging. State-of-the-art inter-chip communication requires power-hungry high-speed I/O circuits and data transfer over long wired traces on substrates. This increases energy consumption and latency while decreasing data bandwidth for chip-to-chip communication. In this paper, we explore the advances and the challenges of interconnecting a multi-chip system with millimeter-wave (mm-wave) wireless interconnects from a variety of perspectives spanning multiple aspects of the wireless interconnection design. Our discussion on the recent advances include aspects such as interconnection topology, physical layer, Medium Access Control (MAC) and routing protocols. We also present some potential paradigm-shifting applications as well as complementary technologies of wireless inter-chip communications.

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