An accelerometer incorporating a laser microencoder for a wide measurable range

Sawada, Renshi; Higurashi, Eiji; Ito, Toshio; Ishikawa, I.

doi:10.1016/j.sna.2006.10.055

Cited by 16 publications

(7 citation statements)

References 17 publications

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“…Thus, tilt sensor made by a single element will have a limited measurement range of high sensitivity, generally

, in which the relation between tilt angle and output acceleration is approximately linear [ 17 ]. However, the range will be extended using a combination of three sensing elements, as shown in Figure 1 .…”

Section: Sensing Principle and Structure Designmentioning

confidence: 99%

A Novel Single-Axis MEMS Tilt Sensor with a High Sensitivity in the Measurement Range from 0∘ to 360∘

Wang

Wei

Weng

et al. 2018

Sensors

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In this paper, a novel single-axis MEMS tilt sensor is presented. It contains a hexagonal proof mass, six micro-lever force amplifiers and three double-ended-tuning fork (DETF) resonant strain gauges. The proof mass is placed in the center with the micro-levers and the DETFs radially arrayed around. The variation of gravity acceleration applied on the proof mass will result in frequency shifts of the DETFs. Angular tilt can be got by analyzing the frequency outputs. The structural design of the tilt sensor is optimized by finite element simulation and the device is microfabricated using a silicon-on-insulator process, followed by open-loop and closed-loop characterizations. Results show that the scale factor of such sensor is at least 11.53 Hz/degree. Minimum Allan deviation of the DETF oscillator is 220 ppb (parts per billion) of the resonant frequency for an 5 s integration time. Resolution of the tilt sensor is 0.002∘ in the whole measurement range from 0∘ to 360∘.

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“…Thus, tilt sensor made by a single element will have a limited measurement range of high sensitivity, generally

Section: Sensing Principle and Structure Designmentioning

confidence: 99%

A Novel Single-Axis MEMS Tilt Sensor with a High Sensitivity in the Measurement Range from 0∘ to 360∘

Wang

Wei

Weng

et al. 2018

Sensors

View full text Add to dashboard Cite

show abstract

“…(5)(6)(7)(8)(9)(10)(11)(12)(13)(14)(15) The scales for a rotary encoder using imprint lithography have been reported. (16) By applying nanoimprint technology, we can successfully form micropatterns by lithography and machine through-holes at the same time.…”

Section: Introductionmentioning

confidence: 99%

Application of Nanoimprint Technology to Diffraction Grating Scale for Microrotary Encoder

Takeshita

Iwasaki

Higurashi

et al. 2013

Sensors and Materials

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Using nanoimprint technology, we developed a rotary diffraction grating scale, which is used for microrotary encoding. The off-center error between the center of the throughhole for inserting a rotational axis and the center of the high-precision micropattern on the periphery of the scale is less than 3 µm because we are able to shape the through-hole and the grating pattern simultaneously. The rotary grating is of sufficient accuracy to use as the scale in a microrotary encoder. The use of nanoimprinting is groundbreaking, in view of the traditionally poor centering precision of grating scale through-holes fabricated by conventional photolithography coupled with the machining of throughholes.

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“…Hybrid integration of materially different components made with wide ranges of processes onto a single platform enables us to construct highly functional, reliable, and low-cost optical devices, such as optical telecommunication modules and microsensors. This technology has been realized by highprecision surface-mount assembly of several micro-optical components such as a laser diode (LD) chip and a photodiode (PD) chip on a single silicon (Si) substrate [1][2][3][4][5]. To realize more highly functional and space-constrained microsystems, it is essential to develop a three-dimensional (3D) integration method of multiple optical components using passive alignment.…”

Section: Introductionmentioning

confidence: 99%

Heterogeneous integration towards an ultra-compact and thin optical displacement microsensor

Higurashi

Sawada

Suga

2009

2009 International Symposium on Optomechatronic Technologies

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This paper focuses on heterogeneous integration technology and its application in optical displacement microsensor. The integration is based on the Au-Au surfaceactivated bonding at a relatively low bonding temperature of 150˚C. Applying this technique, an ultra-compact and thin optical displacement microsensor with three-dimensional structure (2.8 mm × 2.8 mm × 1 mm thick) was fabricated. The feasibility of displacement measurement based on grating interferometer was demonstrated using the prototype microsensor.

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An accelerometer incorporating a laser microencoder for a wide measurable range

Cited by 16 publications

References 17 publications

A Novel Single-Axis MEMS Tilt Sensor with a High Sensitivity in the Measurement Range from 0∘ to 360∘

A Novel Single-Axis MEMS Tilt Sensor with a High Sensitivity in the Measurement Range from 0∘ to 360∘

Application of Nanoimprint Technology to Diffraction Grating Scale for Microrotary Encoder

Heterogeneous integration towards an ultra-compact and thin optical displacement microsensor

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