An Active Thin-Film Cochlear Electrode Array With Monolithic Backing and Curl

Johnson, Angelique C.; Wise, K.D.

doi:10.1109/jmems.2013.2288947

Cited by 19 publications

(25 citation statements)

References 28 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Simulations have also been applied to study the distribution of magnetic fields and current densities (Figure 14b) to optimize the design of an Eddy current sensor array used to identify fatigue cracks in aircrafts' elements, proving consistency with tests [574]. Simulations were also used in a parametric analysis aid in the fabrication of a curled sensor to identify the most rigid structure arrangement [571]. This was carried out by analysing the changes in a ringed structure as a function of the rig and gap lengths.…”

Section: Simulationmentioning

confidence: 94%

“…Finite Element Analysis (FEA) has been the most common numerical method used for simulations, specially using commercial software such as Abaqus [136,451,[568][569][570] or Comsol [571][572][573][574]. These tools have been used to better understand the mechanical behaviour of the sensors prior to the fabrication [568], perform parametric analysis of geometries under adverse mechanical loadings [22,136,[569][570][571], understand electrical behaviour of the components [569,[573][574][575], and to analyze the electrical response under a deformed state [569,573]. Besides, numerical simulations have been proved to be a practical tool in the analysis of changes in capacitance with the effect of strain [576] and for the analysis of electrical performance and mechanical stability of flexible circuits with different configurations under bending loads [572].…”

Section: Simulationmentioning

confidence: 99%

“…These materials have a non-linear elasticity and their simulation have reached a complexity by using hyperelastic models such as the Neo-Hookean [136,451,569] or the Mooney-Rivlin [570] models. However, it has been observed that simplified models can achieve an accurate prediction of the stress-strain distribution with linear elastic material properties [568,571,574]. Parametric FE analysis was conducted to identify the best geometry of the pillars of a PDMS pressure sensor under bi-axial stress and to analyse the performance of the sensor's final configuration under bending and twisting at 180° (Figure 14a) [22].…”

Section: Simulationmentioning

confidence: 99%

See 2 more Smart Citations

Flexible Sensors—From Materials to Applications

et al. 2019

View full text Add to dashboard Cite

Flexible sensors have the potential to be seamlessly applied to soft and irregularly shaped surfaces such as the human skin or textile fabrics. This benefits conformability dependant applications including smart tattoos, artificial skins and soft robotics. Consequently, materials and structures for innovative flexible sensors, as well as their integration into systems, continue to be in the spotlight of research. This review outlines the current state of flexible sensor technologies and the impact of material developments on this field. Special attention is given to strain, temperature, chemical, light and electropotential sensors, as well as their respective applications.

show abstract

Section: Simulationmentioning

confidence: 94%

Section: Simulationmentioning

confidence: 99%

Section: Simulationmentioning

confidence: 99%

See 1 more Smart Citation

Flexible Sensors—From Materials to Applications

et al. 2019

View full text Add to dashboard Cite

show abstract

“…This technique spread throughout the MEMS community and formed the basis for many other novel electromechanical structures. The planar lithography approach has evolved over the years to include integrated interconnects 38 , active electronics 35,39,40 , cochlear implants 41,42 , polytrodes 31 , and three-dimensional arrays 29,[43][44][45] . An important simplification for defining and releasing fine neural probe structures has been the use of silicon-on-insulator (SOI) wafers and deep reactive ion etching (DRIE) 46,47 that many groups have adopted.…”

Section: Recording Brain Activity Brief Historymentioning

confidence: 99%

State-of-the-art MEMS and microsystem tools for brain research

et al. 2017

Self Cite

View full text Add to dashboard Cite

Mapping brain activity has received growing worldwide interest because it is expected to improve disease treatment and allow for the development of important neuromorphic computational methods. MEMS and microsystems are expected to continue to offer new and exciting solutions to meet the need for high-density, high-fidelity neural interfaces. Herein, the state-of-the-art in recording and stimulation tools for brain research is reviewed, and some of the most significant technology trends shaping the field of neurotechnology are discussed.

show abstract

“…When a sufficient number of dislocations aggregate, crack propagation sites form that weaken the material. Fatigue in thin-film devices has been measured in test in vitro by continuously measuring resistance across polyimide (Kisban et al, 2009) or Parylene (Johnson, 2011) test cables bent to 90° angles for thousands or millions of cycles, and in vivo by measuring ECG signals for ~10,000 heart beats .…”

Section: Bending Fatigue Device Designmentioning

confidence: 99%

Mechanical Properties of Thin-Film Parylene–Metal–Parylene Devices

Lee

Meng

2015

Front. Mech. Eng.

View full text Add to dashboard Cite

Structures and testing methods for measuring the adhesion strength, minimum bending diameter, and bending fatigue performance of thin-film polymer electronic architectures were developed and applied to Parylene-metal-Parylene systems with and without the moisture barrier Al2O3 [deposited using atomic layer deposition (ALD)]. Parylene-metalParylene interfaces had the strongest average peel test strength and Parylene-Parylene interfaces had the weakest peel test strength. Layers of ALD Al2O3 deposited within the device increased the average peel strength for Parylene-Parylene interfaces when combined with silane A-174, but did not increase that of the Parylene-metal-Parylene interface. Metal traces in the middle of 24 μm thick Parylene-metal-Parylene devices had a minimum bending diameter of ~130 μm before breaking and being measured as an open circuit. The addition of one layer of Al2O3 above the traces allowed them to be completely creased when bent away from the Al2O3 layer without producing an open circuit, but increased the minimum bending diameter to ~450 μm when bent towards the Al2O3. Although fatigue testing produced cracks in all devices after 100k bends, the insulation of the Parylene-metal-Parylene devices without Al2O3 performed well with electrochemical impedance spectroscopy showing only small decreases in impedance magnitude and small increases of impedance phase at low frequencies. However, devices with Al2O3 failed during EIS due to Al2O3 being deteriorated by water.

show abstract

An Active Thin-Film Cochlear Electrode Array With Monolithic Backing and Curl

Cited by 19 publications

References 28 publications

Flexible Sensors—From Materials to Applications

Flexible Sensors—From Materials to Applications

State-of-the-art MEMS and microsystem tools for brain research

Mechanical Properties of Thin-Film Parylene–Metal–Parylene Devices

Contact Info

Product

Resources

About