An alternative method to the curing study of polymeric die attach adhesives using dynamic mechanical analysis

Tsang, C.; Hui, Hui Kim

doi:10.1016/s0040-6031(00)00653-5

Cited by 6 publications

(3 citation statements)

References 7 publications

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“…Lately, DMA has been used for monitoring cure of thermosetting resins, by which the viscosity of the initial stage of curing and the latter stage of curing (after gelation) are generally studied. Based on the changes in viscosity, DMA can detect cure development and important transitions in cure process such as gelation and vitrification point . However, according to the author's knowledge, no comprehensive work was dedicated to monitor and predict optimum cure time of rubber compounds.…”

Section: Introductionmentioning

confidence: 99%

A new method to predict optimum cure time of rubber compound using dynamic mechanical analysis

Khimi

Pickering

2013

J of Applied Polymer Sci

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The degree of vulcanization of a rubber compound has a big influence on the properties of the final product. Therefore, precisely defining the curing process including optimum cure time is important to ensure the production of final products having high performance. Typically, vulcanization is represented using vulcanization curves. The main types of equipment used for producing vulcanization curves are the oscillating disc rheometer (ODR) and the moving die rheometer (MDR). These can be used to plot graphs of torque versus time at a constant temperature to show how cure is proceeding. Based on the results obtained, optimum cure time (t 90 ) is calculated as the time required for the torque to reach 90% of the maximum achievable torque. In this study, the use of Dynamic Mechanical Analysis (DMA) for assessment of t 90 was assessed. DMA was carried out using shear mode isothermal tests to measure the changes in material properties caused by vulcanization. The results revealed that the shear storage modulus (G 0 ), shear loss modulus (G 00 ), and tan d all reflect the vulcanization process, however, tan d gave the best representation of level of vulcanization. Indeed, the curve of tan d was able to be used to derive the t 90 for rubber compounds and showed good agreement with the results from an MDR.

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Section: Introductionmentioning

confidence: 99%

A new method to predict optimum cure time of rubber compound using dynamic mechanical analysis

Khimi

Pickering

2013

J of Applied Polymer Sci

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“…A few studies are dedicated to adhesive in a configuration of bonded assembly. Most of them use this technique for evaluating the curing of thermosets [8][9][10] as an alternative to differential scanning calorimetry. Influence of environmentally induced ageing [11,12] or specific parameters to bonding process, like surface pretreatment of substrates [13,14], is also investigated.…”

Section: Introductionmentioning

confidence: 99%

New bonded assembly configuration for dynamic mechanical analysis of adhesives

Caussé

Cortes

Dantras

et al. 2013

International Journal of Adhesion and Adhesives

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International audienceA new sample configuration has been developed in order to study molecular mobility of an adhesive in a bonded assembly configuration by dynamic mechanical analysis. The torsional rectangular mode is used to provide a shear solicitation all along the adherend/adhesive interface. The initial mechanical properties of each assembly's constituent are first investigated as reference. The modulus of aluminum foils used as substrates exhibits a classic elastic component and a slight viscous part due to microstructural changes or stress relaxation. Four relaxation modes are highlighted and identified for epoxy adhesive tested as a bulk material. Its viscoelastic behavior is compared to the one of adhesive tested in assembly configuration. The relaxation modes of the adhesive remain visible in spite of the sample stiffening by aluminum foils. Relaxation modes comparison shows that the temperature of loss modulus associated with the mechanical manifestation of glass transition slightly increases for the assembly configuration. Energy losses during this relaxation are much higher in the assembly configuration. Influence of rigid aluminum substrates is discussed in terms of the adhesively bonded joint solicitation mode

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“…Many methods have been developed in the literature to monitor shrinkage by measuring a decrease in thickness (constant force) or an increase in mold force (constant thickness). Many disparate fields such as historical parchment restoration, 10 silicon wafer die adhesives, 11 and drug delivery 12 are interested in evaluating material shrinkage and resulting mechanical properties under different environments. Dental adhesives have been studied extensively, as any adhesive shrinkage can cause the oral implant to fail 13–18 .…”

Section: Introductionmentioning

confidence: 99%

On-Line Force Measurement to Monitor Contact Lens Polymerization

Tucker¹,

Kapoor²,

Elliott³

2012

Experimental Techniques

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Polymerization often causes a decrease in material density as monomers are cross‐linked to form a dense matrix. This decrease in volume can induce anisotropic stress and strain in the polymerized material leading to defects in the final product, especially if the strain is not dissipated. The measurement of polymerization stress can help in improving quality of the final product through changes in lens design, curing conditions, or formulation. This article focuses on development of an in situ force monitoring method, which monitors the polymerization force as the contact lens is formed between two mold halves. This force is an accumulation of multiple stresses such as prepolymer shrinkage and polymer–mold interactions. If polymerization stresses could be controlled during manufacturing, product yield could be improved. Well‐established techniques, such as rheometry, were also used for further understanding of polymer curing.

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An alternative method to the curing study of polymeric die attach adhesives using dynamic mechanical analysis

Cited by 6 publications

References 7 publications

A new method to predict optimum cure time of rubber compound using dynamic mechanical analysis

A new method to predict optimum cure time of rubber compound using dynamic mechanical analysis

New bonded assembly configuration for dynamic mechanical analysis of adhesives

On-Line Force Measurement to Monitor Contact Lens Polymerization

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