2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) 2018
DOI: 10.1109/eptc.2018.8654435
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An Alternative Packaging Solution in Achieving Moisture Sensitivity Level One (1) for Small Outline Integrated Circuit (SOIC) Automotive Package

Alvin B. Denoyo1,
Rod J. Delos Santos2,
Ton C. Pinili3
et al.
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