An Analysis of Dispatching Rules in a Semiconductor Wafer Fabrication Environment

McCutchen, Thomas; Lee, Chung Yee

doi:10.1142/s0960313195000190

Cited by 7 publications

(3 citation statements)

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“…A great deal of research has been done on the dynamic production scheduling problem. For example, McCutchen and Lee (1995) proposed five dispatching rules to determine the priorities of products, and came to the conclusion that the critical ratio and dispatch priority policies outperform the earliest due date, slack and first-come-firstservice policies. In addition, Zhang et al (2006) proposed a double-feedback-based collaborative control strategy for a re-entrant manufacturing system.…”

Section: Literature Reviewmentioning

confidence: 99%

A two-layer dynamic scheduling method for minimising the earliness and tardiness of a re-entrant production line

Yan

Wang

2012

International Journal of Production Research

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This study focuses on the dynamic scheduling problem of a re-entrant production line, in which all of the parts are assumed to have the same processing routes and be processed on every machine. A two-layer dynamic scheduling method is proposed for the dynamic scheduling of the re-entrant line with the objective of minimising total earliness and tardiness. This method consists of two layers. The top layer is to select the appropriate scheduling policy, and the bottom layer is to generate the scheduling by using the policy selected in the top layer. In the top layer, three different rules are constructed for selecting scheduling policies, namely the lateness comparison rule, the lateness variation comparison rule, and the equal interval switching rule. In the bottom layer, three different scheduling policies are proposed to generate the real-time scheduling for manufacturing, namely the FCFS (first come first service) scheduling policy, the PI (proportional-integral) scheduling policy, and the fuzzy PI scheduling policy. Considering that the real-time status of manufacturing changes constantly, it is necessary to switch among different scheduling policies to adapt to this change. Numerical experiments are performed in the situations with and without urgent jobs. The results show that the proposed two-layer dynamic scheduling method outperforms any single scheduling policy (e.g., the FCFS policy, the PI policy and the fuzzy PI policy) for the dynamic scheduling of a re-entrant production line.

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Section: Literature Reviewmentioning

confidence: 99%

A two-layer dynamic scheduling method for minimising the earliness and tardiness of a re-entrant production line

Yan

Wang

2012

International Journal of Production Research

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“…Regarding the performance-oriented control, we observe that most of the existing dispatching/ scheduling policies (e.g. the dispatching rules of Panwalkar and Iskander (1977) and McCutchen and Lee (1995), the distributed scheduling policies of Lu and Kumar (1991), and the more computationally involved tracking policies of Sharifnia (1995) can be easily implemented in the context of the generic control logic depicted in figure 3. However, some recently obtained results (Reveliotis 1999) indicate that the effectiveness and efficiency of these scheduling J.…”

Section: Distributed Event-driven Control Architecture 113mentioning

confidence: 99%

“…Current semiconductor manufacturing practices have primarily addressed only performance-related issues, trying to maintain high resource utilization through (i) job-release (wafer-start) control, and (ii) the employment of heuristic/dispatching rules for controlling the part flow among the different bays and/or bay processes (e.g. McCutchen and Lee 1995, Patel 1999, Zoghby 1999. Typically, the scheduling logic applied in a particular fab is a customized combination of a set of generic job-release and/or dispatching rules, which is shown to be efficient for the particular fab context through extensive simulation experiments.…”

Section: Introductionmentioning

confidence: 99%

A distributed, event-driven control architecture for flexibly automated manufacturing systems

Park¹,

Reveliotis²,

Bodner³

et al. 2002

International Journal of Computer Integrated Manufacturing

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This paper presents a new distributed real-time control architecture for flexibly automated production systems. The modelling assumptions underlying the design are driven by, and abstract, the structure and operations of the emerging 300 mm semiconductor manufacturing fab, one of the most extensively automated environments in contemporary manufacturing. The key element of the controller design itself, which differentiates it from past efforts, is the distribution of the control function to the constituent components of the system shop-floor architecture, while maintaining both the logical correctness and the efficiency of the system behaviour. The architecture was designed to be easily implementable in the actual system shop-floor, and therefore is aligned with, and augments, current practices in these environments. From a theoretical perspective, the proposed design has employed, integrated and extended a series of theoretical results from the field of Discrete Event Dynamical Systems. It is our expectation that the proposed architecture will also provide a formal framework for further analytical studies on the performance evaluation and performance-oriented control/scheduling of the considered class of manufacturing systems.

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High-fidelity rapid prototyping of 300 mm fabs through discrete event system modeling

Park

Reveliotis

Bodner

et al. 2001

Computers in Industry

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An Analysis of Dispatching Rules in a Semiconductor Wafer Fabrication Environment

Cited by 7 publications

References 0 publications

A two-layer dynamic scheduling method for minimising the earliness and tardiness of a re-entrant production line

A two-layer dynamic scheduling method for minimising the earliness and tardiness of a re-entrant production line

A distributed, event-driven control architecture for flexibly automated manufacturing systems

High-fidelity rapid prototyping of 300 mm fabs through discrete event system modeling

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