An Appraisal of High Temperature Humidity Stress Tests for Assessing Plastic Encapsulated Semiconductor Components

Merrett, R.P.; Bryant, J P; Studd, R.

doi:10.1109/irps.1983.361964

Cited by 16 publications

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“…Corrosion has long been one of the major failure mechanisms for plastic encapsulated silicon chips (1,2). Historically, there have been two major failure mechanisms associated with VLSI corrosion: bond pad corrosion (3,4) (typically due to the influx of chlorine ions from the package exterior), and internal corrosion (5-8) (due, in the case of phosphorus-doped passivation or flow layers, to high concentrations of phosphorus). More recently, there has been a movement to increase the integrity of the passivation overcoat, while at the same time reducing the concentration of phosphorus in the layer of oxide beneath the metallization.…”

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confidence: 99%

Recent Observations on VLSI Bond Pad Corrosion Kinetics

Dunn

McPherson

1988

J. Electrochem. Soc.

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confidence: 99%

Recent Observations on VLSI Bond Pad Corrosion Kinetics

Dunn

McPherson

1988

J. Electrochem. Soc.

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“…Thus, in testing bipolar plastic encapsulated devices (PEDs) from six manufacturers, Merrett et af. 16 found that the relative failure rate difference between them at high temperature was smaller than at low temperature, although the ranking remained the same. This could be expressed either by saying that nT is dependent on quality, or that no is dependent on temperature.…”

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confidence: 87%

Reliability prediction: A constructive critique of MIL‐HDBK‐217E

Blanks

1988

Quality & Reliability Eng

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MIL-HDBK-217E is based on some major fallacies and oversimplifications. These include the assumption of constant failure rate, the assumed independence of the Pi factors, the oversimplification of temperature dependence, the neglect of process yield and screening fall-out as determinants in the categorization of quality grade and the absence of manufacturing date information. These weaknesses are discussed and some recommendations made.

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“…In experiments in which the life of a device is to be predicted by accelerated aging at two or more elevated temperatures, batch sizes of 50 or more have been used (e.g. Merret [16]), and this apparatus can be configured for such an experiment, but it would not be suitable for the >600 samples in each batch used by, for example, Nachbauer [17].…”

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confidence: 99%

Apparatus to investigate the insulation impedance and accelerated life-testing of neural interfaces

et al. 2018

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Objective. Neural interfaces and other implantable micro-devices that use polymerencapsulated integrated circuits will only be allowed in medical devices when their lifetimes can be estimated from experimental data. An apparatus has been developed and tested that allows hundreds of insulated samples (interdigitated combs) to be aged under accelerated conditions of high temperature and voltage stress. Occasionally, aging is paused while the sample's impedance is measured; the impedance spectrogram may show degradation as it progresses before failure. Approach. The design was based on practical considerations which are reviewed. A Solartron Modulab provides the frequency response analyser and the femtoammeter. The apparatus can accommodate batches of samples at several temperatures and with different aging voltage waveforms. It is important to understand features of the spectra that are not due to comb-comb leakage, but come from other places (for example substrate-solution leakage); some have been observed and investigated using SPICE. Main results. The design is described in detail and test results show that it is capable of making measurements over long periods, at least up to 67 °C. Despite the size of the apparatus, background capacitance is about 1 pF and comb-comb capacitances of about 30 pF can be measured down to 10 mHz, an impedance of about 100 GΩ. An important discovery was the advantage of grounding the bathing solution, primarily in that it raises the measurement ceiling. Observation and SPICE simulation shows that leakage from the substrate to the bathing solution can give phase lags >90°, in contrast to comb-comb leakage which reduces phase lag to <90°. Significance. The value of this paper is that it will facilitate research into the endurance of small implanted devices because, given a description of a proven apparatus, researchers can start building their own apparatus relatively quickly and with confidence.

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An Appraisal of High Temperature Humidity Stress Tests for Assessing Plastic Encapsulated Semiconductor Components

Cited by 16 publications

References 0 publications

Recent Observations on VLSI Bond Pad Corrosion Kinetics

Recent Observations on VLSI Bond Pad Corrosion Kinetics

Reliability prediction: A constructive critique of MIL‐HDBK‐217E

Apparatus to investigate the insulation impedance and accelerated life-testing of neural interfaces

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