2011 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems 2011
DOI: 10.1109/dft.2011.26
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An Architecture to Enable Life Cycle Testing in CMPs

Abstract: CMOS wear-out mechanisms such as time dependent breakdown of gate dielectrics (TDDB), hot carrier injection (HCI), negative bias temperature instability (NBTI), electromigration (EM), and stress induced voiding (SIV) are well documented in the literature. Often the onset of wear-out is gradual, with initial manifestation as delay defects that result in timing errors. This motivates the need for online testing. The combined effect of dynamic reconfiguration such as voltage and frequency scaling (DVFS) and signa… Show more

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Cited by 5 publications
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“…They have added various hardware components to apply a test to the processing cores and check their responses. Several works [18][19][20] have used natural core-level redundancy available in a CMP and used processing power of a processing core to test correct operation of another processing core. [21,22] have incorporated BIST (Built-In Self-Test) components into the CMP architecture and have provided a mechanism that periodically triggers the BIST circuitry to test various components of a CMP.…”
Section: Introductionmentioning
confidence: 99%
“…They have added various hardware components to apply a test to the processing cores and check their responses. Several works [18][19][20] have used natural core-level redundancy available in a CMP and used processing power of a processing core to test correct operation of another processing core. [21,22] have incorporated BIST (Built-In Self-Test) components into the CMP architecture and have provided a mechanism that periodically triggers the BIST circuitry to test various components of a CMP.…”
Section: Introductionmentioning
confidence: 99%