2022
DOI: 10.1007/s11664-022-09937-5
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An EBSD Study of Fatigue Crack Propagation in Bonded Aluminum Wires Cycled from 55°C to 85°C

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Cited by 3 publications
(3 citation statements)
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“…However, the model currently does not consider temperature, microstructure, frequency, or other loading situations. Some investigations in the literature have shown that these boundary conditions can affect the fatigue behavior of the wires [5][6][7][14][15][16][17][18]21,22]. Further investigations in address these influences are planned.…”
Section: Discussionmentioning
confidence: 99%
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“…However, the model currently does not consider temperature, microstructure, frequency, or other loading situations. Some investigations in the literature have shown that these boundary conditions can affect the fatigue behavior of the wires [5][6][7][14][15][16][17][18]21,22]. Further investigations in address these influences are planned.…”
Section: Discussionmentioning
confidence: 99%
“…The influence of the organic or inorganic encapsulation on the reliability of the wire bridges, for example, is evaluated in [12,13], while [14][15][16] perform accelerated mechanical fatigue tests to investigate the influence of thermo-mechanical shear stress on wire lift-offs. The changes in the microstructure near the bonding interface and crack propagation due to power cycling are investigated by [17][18][19][20].…”
Section: Introductionmentioning
confidence: 99%
“…When the crack initiates from this place, the plastic strain becomes the largest at the tip of the crack, so the crack will propagate to the center along the wiremetallization interface. Nevertheless, in the process of temperature variation from 55°𝐶 to 85°𝐶 (test#1) and to 95°𝐶 (test#2), the coarsening of aluminum grains will lead to weak points between grains, changing the propagation path of cracks [19]. Therefore, the shape of cracks in solder is irregular, and cracks all propagate near the wire-metallization interface.…”
Section: Crack Evolutionmentioning
confidence: 99%