2023
DOI: 10.1016/j.applthermaleng.2023.120325
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An effective method for hot spot temperature optimization in heat conduction problem

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Cited by 11 publications
(3 citation statements)
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“…However, a lower forward voltage means a higher leakage current, raising the risk of thermal runaway. 48 Thus, the bypass diodes must conduct when one cell is shaded, and the shaded cell must be operating under its breakdown voltage. 48 In 2018, Shin et al, 49 studied the effect of operating conditions on the photovoltaic parameters of installed bypass diode on the back side of PV module in a closed junction box.…”
Section: Minimization and Prevention Of Shaded Cell And Hotspot Lossmentioning
confidence: 99%
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“…However, a lower forward voltage means a higher leakage current, raising the risk of thermal runaway. 48 Thus, the bypass diodes must conduct when one cell is shaded, and the shaded cell must be operating under its breakdown voltage. 48 In 2018, Shin et al, 49 studied the effect of operating conditions on the photovoltaic parameters of installed bypass diode on the back side of PV module in a closed junction box.…”
Section: Minimization and Prevention Of Shaded Cell And Hotspot Lossmentioning
confidence: 99%
“…48 Thus, the bypass diodes must conduct when one cell is shaded, and the shaded cell must be operating under its breakdown voltage. 48 In 2018, Shin et al, 49 studied the effect of operating conditions on the photovoltaic parameters of installed bypass diode on the back side of PV module in a closed junction box. The result gives insight into an easy heat dissipation and leakage current monitoring method under high temperature when designing a bypass diode junction box.…”
Section: Minimization and Prevention Of Shaded Cell And Hotspot Lossmentioning
confidence: 99%
“…In the field of electronic device cooling, heat sinks are important for thermal management, because heat can dissipate quickly to ensure the normal operation of core components. It is also necessary to optimize the heat conductive path and composite material layout [11,20]. In the field of solid-state refrigeration, materials with a high caloric effect have a low thermal conductivity and require the insertion of high-thermal-conductivity materials to improve heat transfer from the substrate to cold/hot ends and heat regeneration between substrates, thus establishing an adequate temperature span and achieving a sufficient cooling performance [12,21].…”
Section: Introductionmentioning
confidence: 99%