Abstract:The chemical mechanism of inducing polymer breakage in a photoresist layer plays an important role in the photoresist removal from an indium tin oxide substrate. The spray structure for delivering the relevant functional material is involved in the process of binding and dissolving the PR (photoresist) material. This presents an efficient spraying process of removing the photoresist layer formed on a 260‐nm‐thick indium tin oxide substrate with a CD (cyclodextrine)‐drived aqueous stripper, simultaneously imple… Show more
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