An Electromechanical Impedance‐Based Imaging Algorithm for Damage Identification of Chemical Milling Stiffened Panel

Abstract

The multiple intersecting stiffeners on the chemical milling stiffened panel (CMSP) limit the application of active health monitoring methods on it. An imaging algorithm based on electromechanical impedance (EMI) and probability-weighting is proposed to achieve quantitative evaluation and localization of the damage on CMSP. The proposed algorithm compensates for the difference in sensor performance with coefficients and there is no need to determine the key parameters of the algorithm through prior experiments. In the paper, the applicability of ultrasonic guided wave (GW) and EMI on CMSP was first studied through the finite element method. Based on EMI and the mean absolute percentage deviation (MAPD), the selected damage indicator (DI), a probability-weighted damage imaging algorithm are proposed and experimentally verified. The results indicate that due to the reflection and attenuation effects of stiffeners on GW, the signal characteristics of damage scattering waves are contaminated, making it difficult to quantitatively characterize the damage from GW signals through DIs. MAPD is positively correlated with the damage degree and has consistency in characterizing the signal of different PZTs under the same working condition. The feasibility and accuracy of the proposed algorithm are verified through experiments which show a strong engineering application capability.