An Electron Diffraction Study of Sn/P and Interstitial Ni Ordering in Ni1+mSn1−xPxB8-type Solid Solutions

Furuseth, Sigrid; Larsson, Ann‐Kristin; Withers, Raymond

doi:10.1006/jssc.1997.7683

Cited by 7 publications

(5 citation statements)

References 11 publications

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“…The B8-type crystallites in the high-temperature sample showed the same type of strong and highly structured diffuse scattering in addition to the reflections from the underlying B8-type substructure as reported by Furuseth et al (15).…”

Section: Electron Diffractionsupporting

confidence: 58%

“…However, the large size difference between Sn and P together with the fact that Ni 2 SnP is a fully ordered structure (13) suggests that Sn/P ordering is highly likely even though it could not be detected with X-ray diffraction methods. Therefore, a complete electron diffraction study was undertaken (15) which revealed a rather complicated reciprocal space in samples quenched from 8501 and a superstructure (referred to here as the a-phase) in samples quenched from 7001. All observed reflections in the reciprocal lattice for the a-phase could be indexed with an expression of the type G+mq, where q ¼ 1 22 ½5 % 615Ã : This additional scattering to the Bragg reflections of the hexagonal subcell (G) strongly supports the idea of Sn/P ordering.…”

Section: Introductionmentioning

confidence: 99%

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The Crystal Structure of Ni10Sn5P3

García-García

Larsson

Furuseth

2002

Journal of Solid State Chemistry

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Section: Electron Diffractionsupporting

confidence: 58%

Section: Introductionmentioning

confidence: 99%

The Crystal Structure of Ni10Sn5P3

García-García

Larsson

Furuseth

2002

Journal of Solid State Chemistry

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“…It can be seen that the parameter a constantly and strongly decreases, which is comparable with the evaluation of Furuseth and Fjellvå g. 14 In Ref. 15 Between 850°C and 700°C the two ternary compounds Ni 10 P 3 Sn 5 (T3) 11 and Ni 13 P 3 Sn 8 (T4) 12 develop out of this large ternary solid solution, and the solubility of P in Ni 3 Sn 2 HT was found to be reduced to 3.3 at.% at 550°C (see ''Phase Equilibria at 700°C and 550°C''). Table I.…”

Section: Ternary Solid Solution Of Ni 3 Sn 2 Htsupporting

confidence: 81%

The Ni-rich Part of the Ni-P-Sn System: Isothermal Sections

Schmetterer

Vízdal

Kroupa

et al. 2009

Journal of Elec Materi

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Due to the use of phosphorus-containing nickel substrates in microelectronics, understanding of their reaction with Sn-based solders and knowledge of the corresponding reaction products is highly important. Therefore the ternary Ni-P-Sn system was investigated experimentally using x-ray diffraction (XRD), scanning electron microscopy (SEM) + energy dispersive x-ray spectroscopy (EDX)/wavelength-dispersive x-ray spectroscopy (WDS), and differential thermal analysis (DTA). Sample preparation was done by alloying powders of the starting components contained in alumina crucibles in evacuated quartz tubes. In this study the phase equilibria in the Ni-rich part of the ternary Ni-P-Sn system are described in the form of three partial isothermal sections at 550°C, 700°C, and 850°C. A total of five ternary compounds exist in the Ni-rich part, and the binary Ni 3 Sn 2 HT phase was found to dissolve 17.6 at.% P at 850°C. This well agrees with literature reports, while a different extent and shape of the large homogeneity range of this phase were found. Between 850°C and 700°C phase equilibria change significantly due to the formation of the ternary phases Ni 10 P 3 Sn 5 (T3), Ni 13 P 3 Sn 8 (T4), and Ni 2 PSn (T5).

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“…8,9) Figure 2 is from the centre of the sample and appears to contain two distinct intermetallic compounds: (i) Cu-rich regions are probably Cu 6 Sn 5 , and (ii) the Ni-rich region containing P is probably a binary Ni-xP or ternary Ni-xP-(Sn) phase, 8,9) similar to Fig. 1.…”

Section: Intermetallic Compoundsmentioning

confidence: 72%

Effects of Phosphorus on Microstructure and Fluidity of Sn-0.7Cu-0.05Ni Lead-Free Solder

et al. 2008

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Phosphorus is often added to wave-solder baths as an anti-oxidation agent. Despite this practice, there is little information on how phosphorus influences the solidification and flow properties of new lead-free solders such as Sn-0.7Cu-0.05Ni. This paper investigates the effects of phosphorus content on microstructure and maximum fluidity length in Sn-0.7Cu-0.05Ni-xP alloys containing 0-0.08 mass% phosphorous. Ppm levels of phosphorous are found to cause Sn-xP, Ni-xP-(Sn) and Cu-xP-(Sn) intermetallic compounds to form in the liquid solder. The IMCs are less dense than liquid Sn and float towards the surface of the melt driven by buoyancy. It is shown that P-free Sn-0.7Cu-0.05Ni solidifies with a near-eutectic microstructure whereas, when P is added to this alloy, a significant volume fraction of primary Sn dendrites form once the P content exceeds $0:01 mass% P. It is further shown that P additions decrease the ability of Sn-0.7Cu-0.05Ni to flow as it solidifies.

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An Electron Diffraction Study of Sn/P and Interstitial Ni Ordering in Ni1+mSn1−xPxB8-type Solid Solutions

Cited by 7 publications

References 11 publications

The Crystal Structure of Ni10Sn5P3

The Crystal Structure of Ni10Sn5P3

The Ni-rich Part of the Ni-P-Sn System: Isothermal Sections

Effects of Phosphorus on Microstructure and Fluidity of Sn-0.7Cu-0.05Ni Lead-Free Solder

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