An electrostatic field sensor operated by self-excited vibration of MEMS-based self-sensitive piezoelectric microcantilevers

Kobayashi, Takeshi; Oyama, Shoji; Makimoto, Natsumi; Okada, Hironao; Itoh, T.; Maeda, Ryutaro

doi:10.1016/j.sna.2013.04.016

Cited by 26 publications

(12 citation statements)

References 7 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Thus far, studies have developed noncontact static electricity measurement methods such as electrostatic voltmeters with various types of dielectric electrodes or field-mill type voltmeters [ 9 , 10 , 11 , 12 ], microelectromechanical-system-based sensors [ 13 , 14 ], and sound-wave-based methods [ 15 , 16 , 17 ]. In an insulator, the charge generated by contact or peeling is held where it is generated without diffusing owing to the high surface resistance of the insulating material.…”

Section: Introductionmentioning

confidence: 99%

System for Visualizing Surface Potential Distribution to Eliminate Electrostatic Charge

Kikunaga

2021

Sensors

View full text Add to dashboard Cite

A mixture of positive and negative static charges exists in the same plane on an insulator surface, and this can cause production quality problems at manufacturing sites. This study developed a system with a vibration array sensor to rapidly measure the surface potential distribution of an object in a non-contact and non-destructive manner and with a high spatial resolution of 1 mm. The measurement accuracy differed greatly depending on the scanning speed of the array sensor, and an optimum scanning speed of 10 mm/s enabled rapid measurements (within <3 s) of the surface potential distribution of a charged insulator (area of 30 mm × 30 mm) with an accuracy of 15%. The relationship between charge and dust on the surface was clarified to easily visualize the uneven static charges present on it and thereby eliminate static electricity.

show abstract

Section: Introductionmentioning

confidence: 99%

System for Visualizing Surface Potential Distribution to Eliminate Electrostatic Charge

Kikunaga

2021

Sensors

View full text Add to dashboard Cite

show abstract

“…In the last two decades, with the rapid development of Micro-electro-mechanical Systems (MEMS) technology, much literature on electric field sensor chips (EFSCs) has emerged, providing various EFSCs with the advantages of low power cost, small size, high integration, and convenience for batch production. These EFSCs can be classified into three categories according to their working principles, namely, induction charge [ 7 , 8 , 9 , 10 , 11 , 12 ], electrostatic force [ 13 , 14 ], and steered-electrons [ 15 ]. These EFSCs focus on direct current (DC) and low-frequency alternating current (AC) electric field measurement.…”

Section: Introductionmentioning

confidence: 99%

Design, Fabrication and Characterization of a MEMS-Based Three-Dimensional Electric Field Sensor with Low Cross-Axis Coupling Interference

Ling

Peng

Ren

et al. 2018

Sensors

View full text Add to dashboard Cite

One of the major concerns in the development of three-dimensional (3D) electric field sensors (EFSs) is their susceptibility to cross-axis coupling interference. The output signal for each sensing axis of a 3D EFS is often coupled by electric field components from the two other orthogonal sensing axes. In this paper, a one-dimensional (1D) electric field sensor chip (EFSC) with low cross-axis coupling interference is presented. It is designed to be symmetrical, forming a pair of in-plane symmetrically-located sensing structures. Using a difference circuit, the 1D EFSC is capable of sensing parallel electric fields along symmetrical structures and eliminating cross-axis coupling interference, which is contrast to previously reported 1D EFSCs designed for perpendicular electric field component measurement. Thus, a 3D EFS with low cross-axis coupling interference can be realized using three proposed 1D EFSCs. This 3D EFS has the advantages of low cross-axis coupling interference, small size, and high integration. The testing and calibration systems of the proposed 3D EFS were developed. Experimental results show that in the range of 0–120 kV/m, cross-axis sensitivities are within 5.48%, and the total measurement errors of this 3D EFS are within 6.16%.

show abstract

“…A thin film PZT is widely utilized in piezoelectric MEMS devices such as gyros [4], inkjet heads [5], RF-MEMS switches [6], and ultrasonic transducers [7]. We have reported various kinds of piezoelectric devices including microscanners [8,9], self-sensitive microcantilevers [10,11], electrostatic field sensors [12,13], accelerometers [14,15], trigger switches for wireless sensor nodes [16,17], pyroelectric sensors [18], and energy harvesters [19,20]. Moreover, we have utilized MEMS-based piezoelectric microcantilevers to investigate the crystal structure [21,22] and fatigue behavior [23] of PZT thin films.…”

Section: Introductionmentioning

confidence: 99%

Ultra-Thin Piezoelectric Strain Sensor Array Integrated on a Flexible Printed Circuit Involving Transfer Printing Methods

et al. 2016

View full text Add to dashboard Cite

In this paper, we present a novel sensor array manufacturing process that involves transfer printing methods using a chip mounter with a vacuum collet. Using these methods, one can mount not only ultra-thin microsensors but also microcontroller and amplifier chips required for sensor device fabrication. We successfully transfer-printed a very fragile MEMS-based 5-mm-long, 1-mm-wide, 5-µm-thick high-aspect-ratio ultra-thin PZT(1.9 µm)/Si(3 µm) strain sensor onto a flexible printed-circuit (FPC) substrate with etched Cu wiring. Then, we connected the sensor to the wiring by printing a conductive paste using a screen printer. Large ferroelectric polarization-voltage hysteresis curves were obtained even after the transfer printing process. Since an output voltage corresponding to the magnitude of the strain from the developed sensor was generated, it was confirmed that ultra-thin sensors could be integrated to the FPC substrate by these transfer and screen printing techniques without damage. The PZT thin films have shown 0.18 mV/µε of dynamic strain sensitivity according to the resonant vibration of the stainless plate.

show abstract

An electrostatic field sensor operated by self-excited vibration of MEMS-based self-sensitive piezoelectric microcantilevers

Cited by 26 publications

References 7 publications

System for Visualizing Surface Potential Distribution to Eliminate Electrostatic Charge

System for Visualizing Surface Potential Distribution to Eliminate Electrostatic Charge

Design, Fabrication and Characterization of a MEMS-Based Three-Dimensional Electric Field Sensor with Low Cross-Axis Coupling Interference

Ultra-Thin Piezoelectric Strain Sensor Array Integrated on a Flexible Printed Circuit Involving Transfer Printing Methods

Contact Info

Product

Resources

About