An embedded 60‐GHz planar bandpass filter in multilayer advanced thick‐film system‐in‐package technology

Abstract

The design and performance of an embedded 60‐GHz planar coupled line bandpass filter in multilayer photoimageable thick‐film system‐in‐package technology is presented. The filter is designed employing open stubs to achieve low insertion loss of 3.4 dB, a return loss of −10 dB across wideband and good selectivity. This is one of the highest performance coupled line filters yet reported at V‐band for cost‐effective thick‐film based technologies. © 2011 Wiley Periodicals, Inc. Microwave Opt Technol Lett 53:2221–2224, 2011; View this article online at wileyonlinelibrary.com. DOI 10.1002/mop.26261

Experimental study of the effect of ground width for millimetre-wave multilayer coplanar waveguides in ceramic multichip module technology

“…1 [8,19]. The first step of the photoimageable process is the deposition of the photosensitive paste everywhere over the total area of the substrate by a conventional off-contact screen printer.…”

“…Using this advanced technology the thin-film microstrip and initial results for the CPW have been reported [13,15] and have successfully demonstrated a compact and complete mm-wave MCM receiver at 65 GHz integrating MMICs with other embedded passive components [8,12]. Furthermore, the technology is compatible with many fabrication processes including LTCC and thin film, and is being considered as a viable approach to realise compact and cost-effective ceramicbased microwave and mm-wave multi-chip-modules (MCMs) and SIP architectures [8,9,18,19].…”

Advanced multilayer thick‐film technology and TFMS, CPW, and SIW up to 180 GHz for cost‐effective ceramic‐based circuits and modules

“…The technology successfully demonstrated realisation of a highly compact 60 GHz MCM receiver integrating MMICs with embedded passive antenna and filter [5], and shown suitability for cost-effective mm-wave MCM and SiP [5,19] applications. The process has previously been used for realising a wide range of lumped components with high Q and self-resonance frequency (SRF) [24] and a range of passive components, including couples, filters, and antennas, and circuits with remarkably high performance and miniaturisation [23][24][25][26][27][28]. Further, the materials (dielectric/conductor) have been characterised [13,23] and the initial results for planar transmission lines (TFMS and CPW) and SIW, mostly with infinite ground/cavity width, were reported [27,29].…”