An Evaluation Process of Polymeric Adhesive Wafer Bonding for Vertical System Integration

Kwon, Yongchai; Seok, Jongwon

doi:10.1143/jjap.44.3893

Cited by 10 publications

(7 citation statements)

References 27 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…One of these thermal treatments is solder annealing at 275°C. Figure 6 presents Fourier Transformed Infrared Spectroscopy (FTIR) spectra of the liquid polymer before and after the annealing [4]. The spectra don't show any chemical modification of the polymer which suggests a good resistance to this annealing.…”

Section: Materials Characterizationsmentioning

confidence: 99%

Process solutions and polymer materials for 3D-WLP through silicon via filling

Bouchoucha

Chausse

Henry

et al. 2010

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC)

View full text Add to dashboard Cite

This paper deals with the development of a process for medium density through silicon via (TSV) polymer filling. This solution is driven by reliability considerations. Firstly, a set of specifications concerning the polymer selection is presented. Secondly, the process optimization with two kinds of polymers is presented: a liquid resin and a dry film resist. Issues with both of the solutions are also discussed. Different types of TSV are studied (shapes and dimensions). Finally, material characterizations are achieved in order to determine the ability of the polymer to be integrated in the TSV and 3D stacking processes. Other characterizations will be useful for further thermo-mechanical studies.

show abstract

Section: Materials Characterizationsmentioning

confidence: 99%

Process solutions and polymer materials for 3D-WLP through silicon via filling

Bouchoucha

Chausse

Henry

et al. 2010

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC)

View full text Add to dashboard Cite

show abstract

“…Adhesion strength: The adhesives should possess high bonding strength to support wafers during harsh processes such as backgrinding and polishing. The adhesion strength was evaluated using the peel test, the Maszara razor blade method [5], and rheological analysis.…”

Section: Post-bonding Uniformitymentioning

confidence: 99%

“…Using temporary adhesives to bond the processed device wafer to a rigid carrier wafer offers an efficient solution, and is becoming increasingly important in both integrated circuit and MEMS applications, mainly due to its low cost, ease of processing, and adaptability [1][2][3][4][5].…”

Section: Introductionmentioning

confidence: 99%

High-Performance Temporary Adhesives for Wafer Bonding Applications

et al. 2006

View full text Add to dashboard Cite

Myriad structures for stacking chips, power devices, smart cards, and thin substrates for processors have one thing in common: thin silicon. Wafer thinning will soon be an essential process step for most of the devices fabricated and packaged henceforth. The key driving forces for thinned wafers are improved heat dissipation, three-dimensional stacking, reduced electrical resistance, and substrate flexibility. Handling of thin and ultrathin substrates however is not trivial because of their fragility and tendency to warp and fold. The thinned substrates need to be supported during the backside grinding process and through the subsequent processes such as lithography, deposition, etc. Using temporary adhesives to attach the processed device wafer to a rigid carrier wafer offers an efficient solution. The key requirements for such materials are ease of application, coating uniformity with minimal thickness variation across the wafer, good adhesion to a wide variety of surfaces, thermal stability in processes such as dielectric deposition and metallization, and ease of removal to allow high throughput. An additional requirement for these materials is stability in harsh chemical environments posed by processes such as etching and electroplating. Currently available materials meet only a subset of these requirements. None of them meet the requirement of high-temperature stability combined with ease of removal. We have developed adhesives that meet a wide range of post-thinning operating temperatures. Additionally, the materials are soluble in industry-accepted safe solvents and can be spin-applied to required thicknesses and uniformity. Above all, the coatings can be removed easily without leaving any residue. This paper reports on the development of a wide range of temporary adhesives that can be used in wafer thinning applications while applying both novel and conventional bonding and debonding methods.

show abstract

“…Therefore, the device wafer need to be bonded firmly to a carrier wafer during the backside processing of the device wafer, and readily separated from the carrier after backside processing. Using temporary adhesive to bond the device wafer to a carrier wafer offers an efficient solution, which has become increasingly important in both 3DIC and MEMS applications, mainly due to its ease of processing, low cost, and adaptability [2][3][4]. Hence, several kinds of temporary adhesive have been reported and available in recent years.…”

Section: Introductionmentioning

confidence: 99%

A novel temporary adhesive for thin wafer handling

Shuai

Sun

Zhang

et al. 2014

2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction M

View full text Add to dashboard Cite

3D integrated circuits (3DICs) by stacking electronic devices can increase system functionality while decreasing the overall footprint. Through silicon via (TSV) technology based on thin wafers (typically below 100 m) has been developed to realize 3DIC stacking over the last decades. Due to their fragileness and tendency of warping, thin device wafer need to be bonded firmly to a carrier wafer during TSV processing and readily separated from the carrier after processing. Adhesives with high temperature tolerance and ease of debonding are critical for the bonding/debonding process. In this present study, a temporary adhesive based on a thermoplastic, which can be debonded by a thermal-sliding method, has been developed. Formulas were optimized to achieve void-free adhesive layer, high throughput (i.e. short bonding and debonding times) and high reliability in the bonded system. The properties of the as-prepared adhesive including the viscosity at different temperatures, thermal and chemical stabilities, thickness and homogeneity of the adhesive layer, adhesion strength and the process of clean-up were investigated systematically.The novel adhesive showed excellent thermal stability and chemical resistance and convenient post-processing, and is easy to process for high-volume manufacturing. These findings extend the candidate polymers for temporary bonding materials and can ultimately promote the practical application of TSV technology.

show abstract

An Evaluation Process of Polymeric Adhesive Wafer Bonding for Vertical System Integration

Cited by 10 publications

References 27 publications

Process solutions and polymer materials for 3D-WLP through silicon via filling

Process solutions and polymer materials for 3D-WLP through silicon via filling

High-Performance Temporary Adhesives for Wafer Bonding Applications

A novel temporary adhesive for thin wafer handling

Contact Info

Product

Resources

About