An experimental and numerical investigation of the use of liquid flow in serpentine microchannels for microelectronics cooling

Al-Neama, Ahmed F.; Kapur, Nikil; Summers, J. L.; Thompson, H. M.

doi:10.1016/j.applthermaleng.2017.02.001

Cited by 93 publications

(30 citation statements)

References 40 publications

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“…The present study is the first to consider the feasibility and performance of using serpentine, rather than conventional straight, water-cooled channel heat sinks for dissipating the high heat fluxes associated with GaN HEMTs. It further extends the recent work of Al-Neama et al [31] to explore and demonstrate the significant additional benefits of using a range of different heat spreader materials, on the cooling of CREE CGHV1J070D GaN HEMT dies [33]. The paper is organised as follows: The MCHSs of interest, experimental apparatus and analytical techniques used to determine their temperature distribution and flow characteristics are described in section 2.…”

Section: Introductionmentioning

confidence: 79%

“…Al-Neama et al [31] have very recently used complementary experimental and numerical methods to investigate the benefits of employing three different serpentine microchannel heat sink designs using single (SPSM), double (DPSM) and triple path serpentine configurations (TPSM). Their performance was compared with that of a design based on straight rectangular microchannels (SRMs) in terms of pressure drop ( ), average Nusselt number ( ) and total thermal resistance ( ).…”

Section: Introductionmentioning

confidence: 99%

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Thermal management of GaN HEMT devices using serpentine minichannel heat sinks

Al-Neama

Kapur

Summers

et al. 2018

Applied Thermal Engineering

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An experimental and numerical investigation of water-cooled serpentine rectangular minichannel heat sinks (MCHS) has been performed to assess their suitability for the thermal management of gallium nitride (GaN) high-electron-mobility transistors (HEMTs) devices. A Finite Element-based conjugate heat transfer model is developed, validated experimentally and used to determine the optimal minichannel width and number of minichannels for a case with a uniform heat flux of 100 W/cm 2. The optimisation process uses a 30 point Optimal Latin Hypercubes Design of Experiments, generated from a permutation genetic algorithm, and accurate metamodels built using a Moving Least Square approach. A Pareto front is then constructed to enable the compromises available between designs with a low pressure drop and those with low thermal resistance to be explored and an appropriate minichannel width and number of minichannels to be chosen. These parameters are then used within conjugate heat transfer models of a serpentine MCHS with silicon, silicon carbide, diamond and graphene heat spreaders placed above a GaN HEMT heating source of area 4.8 × 0.8 mm 2 , generating 1823 W/cm 2. A nanocrystalline diamond (NCD) layer with thickness of 2 µm is mounted on the top surface of the GaN HEMT to function as a heat spreader to mitigate the hot spots. The effect of volumetric flow rate and heat spreader thickness on the chip temperature has been investigated numerically and each of these has been shown to be influential. For example, at a volumetric flow rate of 0.10 l/min, the maximum chip temperature can be reduced from 124.7 o C to 96.7 o C by employing a 25 µm thick graphene heat spreader attached to the serpentine MCHS together with a NCD layer compared with a serpentine MCHS without these heat spreaders.

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Section: Introductionmentioning

confidence: 79%

Section: Introductionmentioning

confidence: 99%

Thermal management of GaN HEMT devices using serpentine minichannel heat sinks

Al-Neama

Kapur

Summers

et al. 2018

Applied Thermal Engineering

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“…It was observed that heat transfer was enhanced by an interruption of the velocity boundary-layer due to the surface roughness of the etched channel structure. Al-Naema et al [19] used serpentine rectangular microchannels with four different geometrical configurations and observed a good agreement between numerical predictions and experimental results. Adib et al [20] presented three-dimensional flow pattern of blood through an S-shaped artery and it was shown that the flow at the entrance accelerated rapidly until arriving at certain nodes with the maximum velocity.…”

Section: Introductionmentioning

confidence: 82%

A study of turbulent heat transfer in convergent-divergent shaped microchannel with ribs and cavities using CFD

Srivastava¹,

Dewan²

2020

JMES

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This paper presents the effects of microchannel shape with ribs and cavities on turbulent heat transfer. Three-dimensional conjugate heat transfer using the SST k-ω turbulence model has been investigated for four different microchannels, namely, rectangular, rectangular with ribs and cavities, convergent-divergent (CD) and convergent-divergent with Ribs and Cavities (CD-RC). The flow field, pressure and temperature distributions and friction factor are analyzed, and thermal resistance and average Nusselt number are compared. The thermal performance of the CD-RC microchannel is found to be better than that of other microchannels considered in terms of an average Nusselt number increased from 16% to 40%. Heat transfer increases due to a strong fluid mixing and periodic interruption of boundary-layer. It is observed that with an increase in Reynolds number (Re), the thermal resitance drops rapidly. The thermal resistance of the CD-RC microchannel is decreased by 30% than that of the rectangular microchannel for Re ranging from 2500 to 7000. However, such design of microchannel loses its heat transfer effectiveness due to a high pumping power at high values of Re.

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“…Исходя из результатов проведенных ранее исследований [6], для рассматриваемого рекуперативного теплообменника был отобран наиболее эффективный вид теплоизоляции [6][7][8]: экранно-вакуумная изоляция с одним и пятью экранами [9][10][11][12][13][14][15][16][17][18][19][20][21]. Это обусловлено тем, что при данной теплоизоляция достижимы наиболее низкие теплопотери при её низкой себестоимости.…”

Section: постановка задачиunclassified

Parametric analysis efficiency screen-vacuum thermal insulation of regenerative heat exchanger heat loss recovery system mobile compressor plant

Chernov¹,

Yusha²,

Kalashnikov³

2019

OSB. Series ARPE

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В работе проводится исследование эффективности экранно-вакуумной теплоизоляции теплообменного аппарата системы рекуперации тепловых потерь мобильной компрессорной установки с применением методики его расчёта, разработанной на базе пакета Ansys (Fluid Flow-Fluent). По результатам численного анализа рабочих процессов в проточной части кожухотрубного рекуперативного теплообменного аппарата установлена взаимосвязь между параметрами теплоизоляции и характеристиками теплообменника. Ключевые слова: теплообменный аппарат, рекуперация, тепловая эффективность, тепловые потери, экранно-вакуумная теплоизоляция.

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An experimental and numerical investigation of the use of liquid flow in serpentine microchannels for microelectronics cooling

Cited by 93 publications

References 40 publications

Thermal management of GaN HEMT devices using serpentine minichannel heat sinks

Thermal management of GaN HEMT devices using serpentine minichannel heat sinks

A study of turbulent heat transfer in convergent-divergent shaped microchannel with ribs and cavities using CFD

Parametric analysis efficiency screen-vacuum thermal insulation of regenerative heat exchanger heat loss recovery system mobile compressor plant

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