An experimental and numerical study of micro-grinding force and performance of sapphire using novel structured micro abrasive tool

Sun, Yangyang; Su, Zhipeng; Gong, Yadong; Jin, Liya; Wen, Quan; Qi, Yang

doi:10.1016/j.ijmecsci.2020.105741

Cited by 38 publications

(8 citation statements)

References 41 publications

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“…The material removal method during the grinding process can be analyzed by the critical cutting depth hc and the undeformed chip thickness hm [29][30][31][32] . The undeformed chip thickness for vertical surface grinding can be obtained from the following equation [8,33,34] :…”

Section: Micro-scale Grinding Mechanism Of Ito Conductive Glassmentioning

confidence: 99%

Experimental investigations into the effect of process parameters on the machining quality for ITO conductive glass using by micro grooves grinding

Liu,

Qiu,

Sun

et al. 2023

Preprint

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To investigate the effect of micro-scale grinding on the quality of ITO conductive glass, this paper conducted micro-scale grinding experiments on ITO conductive glass. The influence of process parameters on machining quality was analyzed using micro-grinding force, surface roughness, and sheet resistance as indicators. Meanwhile, soda-lime glass was set as the control group to analyze the effect of ITO film. The results indicate that brittle fracture is the main removal method for ITO films, and the glass substrate exhibits two different removal methods, brittle and ductile, depending on the process parameters. The ITO thin film layer suppresses the sheet deformation of the glass substrate, increasing the grinding force and reducing the processing quality. Increasing the spindle speed, reducing the feed speed, and reducing the cutting depth can improve the machining quality. The spindle speed has a significant impact on surface roughness, while the cutting depth has a significant impact on the sheet resistance of the thin film. In addition, soda-lime glass chips mainly appear in powder and granular form, while ITO conductive glass also has flaky thin film chips generated by interlayer fracture.

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Section: Micro-scale Grinding Mechanism Of Ito Conductive Glassmentioning

confidence: 99%

Experimental investigations into the effect of process parameters on the machining quality for ITO conductive glass using by micro grooves grinding

Liu,

Qiu,

Sun

et al. 2023

Preprint

View full text Add to dashboard Cite

show abstract

“…So, the number of active diamonds is calculated separately in the (x-z) directions, then the total active grits are obtained by multiplying the active grains on x-axis and z-axis. The number of active diamonds formula is established through identifying the touch arc length λ c as expressed in Equation (15), and the average distance between two active grains λ r is displayed in Equation (9). The touch arc length λ c is defined as [34,35]:…”

Section: Active Abrasive Grainmentioning

confidence: 99%

“…As a result, cracks and pits are easily formed on the workpiece surface, affecting the surface quality of the workpiece and the performance of the device [5][6][7]. Nowadays and because of all these factors, most HBM are processed by grinding due to its high efficiency, but the damage below the surface introduced during grinding has always been a bottleneck problem in machining [8,9]. The most important factor is grinding force, consequently, research on establishing and controlling the grinding force of HBM is particularly important for machining HBM to enhance the grinding efficiency and to upgrade the grinding tool performance [10][11][12][13].…”

Section: Introductionmentioning

confidence: 99%

Model for Predicting the Micro-Grinding Force of K9 Glass Based on Material Removal Mechanisms

et al. 2020

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K9 optical glass has superb material properties used for various industrial applications. However, the high hardness and low fracture toughness greatly fluctuate the cutting force generated during the grinding process, which are the main factors affecting machining accuracy and surface integrity. With a view to further understand the grinding mechanism of K9 glass and improve the machining quality, a new arithmetical force model and parameter optimization for grinding the K9 glass are introduced in this study. Originally, the grinding force components and the grinding path were analyzed according to the critical depth of plowing, rubbing, and brittle tear. Thereafter, the arithmetical model of grinding force was established based on the geometrical model of a single abrasive grain, taking into account the random distribution of grinding grains, and this fact was considered when establishing the number of active grains participating in cutting Nd-Tot. It should be noted that the tool diameter changed with machining, therefore this change was taking into account when building the arithmetical force model during processing as well as the variable value of the maximum chip thickness amax accordingly. Besides, the force analysis recommends how to control the processing parameters to achieve high surface and subsurface quality. Finally, the force model was evaluated by comparing theoretical results with experimental ones. The experimental values of surface grinding forces are in good conformity with the predicted results with changes in the grinding parameters, which proves that the mathematical model is reliable.

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“…Moreover, SATs were found to be effective to reduce grinding temperature and improve machined surface quality as well. Sun et al [12] established the grinding temperature model of SATs, and the results showed that the grinding temperature was reduced by 110 °C compared with the non-structured tool and the reported machined surface roughness Ra and Rz were reduced by 20% and 15%. Similar roughness reduction of 5-20%, together with the subsurface damage depth reduction of 25%, was reported by Guo et al [13] as well.…”

Section: Introductionmentioning

confidence: 99%

On the creation of structured abrasive tools via multiple-pass rotary wire EDM: A geometrical model

Wang

Liu

Zhao

et al. 2023

Int J Adv Manuf Technol

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Structured Abrasive Tools (SATs) are considered as one of the nextgeneration abrasive tool solutions due to their superior ability to transport cutting fluids into grinding zones to lower grinding temperature and therefore enable high-quality machined surfaces. There are several SAT fabrication methods including mechanical, electroplating, brazing and laser-based methods.Mechanical methods can not produce SATs with small-sized structures due to significant contact forces, while electroplating has poor controllability of abrasive grain allocations. Brazing requires special machines with high-precision motion control while laser-based methods need significant efforts on laser parameter selection and optimisation. With this, here we present a Multiple-Pass Rotary Wire Electrical Discharge Machining (MPRWEDM) method to address the aforementioned limitations. We also develop a theorical model of the created kerf profile during the MPRWEDM so as to enable controllable fabrication of SATs.The model was experimentally validated, showing a decent relative error of Page 2 of 39 9.8%. The non-linear multiple-pass effect was studied both analytically and experimentally. Based on MPRWEDM, not only the SAT with designed grooves but also the structured surface (having an array of pyramid geometries) generated by the SAT were successfully created, proving the great potential of MPRWEDM in controllable production of even more advanced tools.

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An experimental and numerical study of micro-grinding force and performance of sapphire using novel structured micro abrasive tool

Cited by 38 publications

References 41 publications

Experimental investigations into the effect of process parameters on the machining quality for ITO conductive glass using by micro grooves grinding

Experimental investigations into the effect of process parameters on the machining quality for ITO conductive glass using by micro grooves grinding

Model for Predicting the Micro-Grinding Force of K9 Glass Based on Material Removal Mechanisms

On the creation of structured abrasive tools via multiple-pass rotary wire EDM: A geometrical model

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