An experimental and theoretical investigation on the brittle ductile transition and cutting force anisotropy in cutting KDP crystal

Wang, Shengfei; An, Chenhui; Zhang, Feihu; Wang, Jian; Lei, Xiangyang; Zhang, Jianfeng

doi:10.1016/j.ijmachtools.2016.04.009

Cited by 84 publications

(39 citation statements)

References 25 publications

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“…Because of anisotropic properties of KDP, the critical depth in various directions is accordingly different. Wang et al reports that the critical depth ranges from 80 nm to 180 nm of critical depth [16]. In the meanwhile, the most approximate regular profiles (red lines) used in FDTD simulation in the following are also shown in Fig.…”

Section: Morphologies Of Scratchesmentioning

confidence: 92%

Laser induced damage due to scratches in the surface of nonlinear optical crystals KH2PO4 (KDP)

Zhu

Zhang

et al. 2017

J. Eur. Opt. Soc.-Rapid Publ.

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Section: Morphologies Of Scratchesmentioning

confidence: 92%

Laser induced damage due to scratches in the surface of nonlinear optical crystals KH2PO4 (KDP)

Zhu

Zhang

et al. 2017

J. Eur. Opt. Soc.-Rapid Publ.

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“…This seems contradictory with the research by Zong et al [14], who demonstrated that the partial ductile mode cutting could be achieved as long as the median crack at the brittle-ductile transition position did not penetrate into the cut surface. Wang et al [20] admitted that all cracks in shoulder region could not penetrate into the cut surface in partial ductile mode cutting, but they found that the depths of all cracks would be no more than zero in the actual processing of KDP crystal. They proposed a loose condition for achieving partial ductile mode cutting, which can be expressed as…”

Section: Depth Prediction Of Cracks In Shoulder Regionmentioning

confidence: 99%

“…They carried out the partial ductile mode cutting experiments on ZnS crystal with the oblique diamond cutting. Wang et al [20] believed that all cracks (i.e., median and lateral cracks) in shoulder region could not penetrate into the cut surface in partial ductile mode cutting. They processed the KDP crystal by partial ductile mode cutting.…”

Section: Introductionmentioning

confidence: 99%

Evaluation of surface and subsurface damages for diamond turning of ZnSe crystal

et al. 2019

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With single-point diamond turning (SPDT), a series of samples are processed under different cutting parameters. The brittle-ductile transition depth of ZnSe crystal is obtained, and the damages of the samples are measured from surface and subsurface damage depths as well as damage density. The effects of cutting parameters on the damages are investigated quantitatively. The results show the cutting depth has a minor while the feed has a major effects on the damages. Also, the interaction effect between feed and cutting depth is very small for surface damage depth or damage density, while it is large for subsurface damage depth. Based on the indentation mechanics and the kinetic characteristics of SPDT, a model is proposed to evaluate the surface and subsurface damage depths of ZnSe crystal by cutting parameters. The model has an average relative error less than 15.0%, which could be further used to obtain the depth and the removal characteristics of cracks in shoulder region.

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“…For KDP crystal, the critical UCT has been investigated under the cutting of {100}, doubler and tripler planes of KDP. The maximum critical UCTs were obtained at different cutting planes [202]. Zong et al [203] proposed a predictive model for the calculation of critical UCT taking the compression force and micro-friction force into consideration.…”

Section: Influence Of Brittle Materialsmentioning

confidence: 99%

Recent Advances in Micro/Nano-cutting: Effect of Tool Edge and Material Properties

Fang

2018

Nanomanuf Metrol

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Micro-and nano-machining technology has been applied in industry to generate high-precision parts with micro/nanometric accuracy or feature size in the recent decades. Cutting is one of the most powerful manufacturing processes, and the material removal mechanism is urgently demanded by the industry to understand and improve the micro/nano-machining process efficiently at a low cost. This paper presents the recent advances in cutting mechanism and its applicability for predicting the surface generation and chip formation, especially when material is removed in micro-and nanoscale. In addition to the industry-concerned performance parameters, fundamental physical parameters such as stresses, strains, temperatures, phase transformation, minimum uncut chip thickness and size effects are discussed in this paper for the indepth understanding of the micro/nano-cutting process.

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An experimental and theoretical investigation on the brittle ductile transition and cutting force anisotropy in cutting KDP crystal

Cited by 84 publications

References 25 publications

Laser induced damage due to scratches in the surface of nonlinear optical crystals KH2PO4 (KDP)

Laser induced damage due to scratches in the surface of nonlinear optical crystals KH2PO4 (KDP)

Evaluation of surface and subsurface damages for diamond turning of ZnSe crystal

Recent Advances in Micro/Nano-cutting: Effect of Tool Edge and Material Properties

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