An experimental investigation of a 100-W high-power light-emitting diode array using vapor chamber–based plate

Abstract

In this study, a compact 100-W input power light-emitting diode array vapor chamber-based plate has been fabricated to investigate the thermal performance. To make a comparison, a typical commercial chip on board-type light-emitting diode array using a copper-based plate which has the same chip layout and the same power input was also investigated. The surface temperature distribution and total thermal resistance corresponding to these two high-power light-emitting diode modules were measured using a thermal infrared camera and a MicReD T3Ster. The experimental results show that the thermal performance of the compact light-emitting diode array using vapor chamber-based plate is much better than that using copper-based plate. The average temperatures of light-emitting diode copper-and vapor chamber-based plates are 100.5°C and 41.5°C at 100 W power input, respectively. In addition, the maximal temperature difference of the 100-W light-emitting diode array vapor chamber-based plate is 2.2°C far less than 31.7°C of copper-based plate. Furthermore, the measurement results show that the vapor chamber can prominently lower the spreading resistance, diminish the hot-spot effect, and increase durability.

Research of the thermal interface of LED lighting sources by thermal relaxation differential spectrometry (TRDS)

“…The analysis of the thermal parameters of the measured sample was carried out by the method of thermal relaxation differential spectrometry (TRDS) using a relaxation impedance spectrometer developed at the Belarusian National Technical University (BNTU) [1,2]. In the TRDS method, as opposed to the known methods that use the structure-function and the differential structure function [2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17], as well as those included in the standard [18], the output of measurement results of the thermal parameters of the measured samples is carried out in the form of a spectrum of thermal parameters, similar to conventional types of spectrum, for example, optical. This type of data presentation is quite informative and convenient for analyzing measurement results.…”

Isı Emici-Isı Borulu İnovatif Bir Yüksek Güçlü LED Termal Yönetim Sisteminin Deneysel ve Nümerik Analizi

“…Junction temperature for different LED input power (Farklı LED giriş güçleri için jonksiyon sıcaklıkları)When we compare this study to the existing literature, we observe that it has a significant novelty value. For example, Zhang et al[35] used a copper based plate with an aluminum radiator, which is of larger size than our designs. Their design managed to cool the copper base of the LED under 100 W heat power load down only to 100.5 C. In another study, Lu et al[36] improved a loop heat pipe for thermal management of high power LED's.The maximum temperature of the heat pipe didn't exceed 100 °C for 100 W LED heat load.…”