2006
DOI: 10.1007/s00170-006-0771-4
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An experimental investigation of temperatures during conventional and CBN grinding

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Cited by 31 publications
(8 citation statements)
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“…The ultrasonic washing concludes each polishing stage of the sample to avoid contamination of the process with the subsequent decreasing granulometry. Vilella's reagent (5 ml HCl, 1 g picric acid, and 100 ml ethanol) was finally used to etch the polished surface for 10 to 15 seconds before cleaning it with ethanol and drying it with hot air [8]. A Zeiss Axio optical microscope (OM) was used to observe the sample thus prepared and chemically etched.…”
Section: Microstructural Analysismentioning
confidence: 99%
“…The ultrasonic washing concludes each polishing stage of the sample to avoid contamination of the process with the subsequent decreasing granulometry. Vilella's reagent (5 ml HCl, 1 g picric acid, and 100 ml ethanol) was finally used to etch the polished surface for 10 to 15 seconds before cleaning it with ethanol and drying it with hot air [8]. A Zeiss Axio optical microscope (OM) was used to observe the sample thus prepared and chemically etched.…”
Section: Microstructural Analysismentioning
confidence: 99%
“…Dla właściwego przeprowadzenia procesu szlifowania powierzchni śrubowych, niezbędne jest rozwiązanie nie tylko problemów geometrycznych, ale także wielu problemów technologicznych [2,6,8,[13][14].…”
Section: Dokładność Procesu Szlifowania Powierzchni śRubo-wychunclassified
“…Should the grinding force of the grinding wheel deteriorate, abnormal grinding phenomena will occur, indicating that pruning is necessary. (7)(8)(9) To enhance the use time and grinding accuracy of grinding wheels, Wu et al (10) and Srivastava et al (11) utilized a high-speed grinding machine to investigate the effects of the grinding force, temperature, and surface characteristics on the surface accuracy of the workpiece in the grinding of SiC materials. They compared the relationship between the real-time grinding force, temperature, and visual appearance of damage and debris in SEM micrographs.…”
Section: Introductionmentioning
confidence: 99%