An experimental study on the adhesion at a nano-contact

Yoon, Eui-Sung; Yang, Seung Ho; Han, Hyemi; Kong, Hosung

doi:10.1016/s0043-1648(03)00302-8

Cited by 77 publications

(53 citation statements)

References 14 publications

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“…(7.8), meniscus forces are expected to be maximal for hydrophilic surfaces (small contact angle) and to vanish for very hydrophobic surfaces. The expected decrease of the adhesion force with increasing hydrophobicity has indeed been observed by several authors [682][683][684][685][686][687][688]. An obvious limitation of Eq.…”

Section: Meniscus Forcesupporting

confidence: 62%

Force measurements with the atomic force microscope: Technique, interpretation and applications

Butt

Cappella

Kappl

2005

Surface Science Reports

3,245

2,949

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Section: Meniscus Forcesupporting

confidence: 62%

Force measurements with the atomic force microscope: Technique, interpretation and applications

Butt

Cappella

Kappl

2005

Surface Science Reports

3,245

2,949

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“…This is with AFM [69,119,[190][191][192][193][194][195][196][197][198]. Many experiments showed a significant dependency of the adhesion force on the relative humidity [40,52,54,56,57,183]. A continuous increase humidity was, for example, observed for the interaction of a silicon nitride tip with mica [194], between silica particles [199], a silica particle and a silicon wafer [200], or between a silicon nitride tip and molybdenum trioxide [201].…”

Section: Influence Of Humidity On Adhesionmentioning

confidence: 92%

“…The reduced Laplace pressure in the meniscus and the surface tension of the liquid cause an attractive force [53]. Many experiments showed a significant dependency of the adhesion force on the vapor pressure [52,[54][55][56][57].…”

Section: Introductionmentioning

confidence: 99%

On the Adhesion between Fine Particles and Nanocontacts: An Atomic Force Microscope Study

et al. 2006

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To optimize the handling of fine powders in industrial applications, understanding the interaction forces between single powder particles is fundamental. The forces between colloidal particles dominate the behavior of a great variety of materials, including paints, paper, soil, and many industrial processes. With the invention of the atomic force microscope (AFM), the direct measurement of the interaction between single micron-sized particles became possible. The adhesional contact between a particle and a substrate is a parameter for analyzing pull-off force data generated by AFM. The aim of this study was to understand surface interactions between fine particles. I measured the adhesion forces between AFM tips or particles attached to AFM cantilevers and different solid samples. Smooth and homogeneous surfaces such as silicon wafer, mica, or highly oriented pyrolytic graphite (HOPG), and more rough and heterogeneous surfaces such as iron particles or patterns of TiO 2 nanoparticles on silicon wafer were used. First, I addressed to the wellknown issue that AFM adhesion experiment results show wide distributions of adhesion forces rather than a single value. My experimental results show that variations in adhesion forces comprise fast (i.e., from one force curves to the next) random fluctuations and slower fluctuations, which occur over tens or hundreds of consecutive measurements. Slow fluctuations are not likely to be the result of variations in external factors such as lateral position, temperature, humidity, and so forth because those were kept constant. Even if two solid bodies are brought into contact under precisely the same conditions (same place, load, direction, etc.) the result of such a measurement will often not be the same as for the previous contact. The measurement itself will induce structural changes in the contact region which can change the value for the next adhesion force measurement.In the second part I studied the influence of humidity on the adhesion of nanocontacts. Humidity was adjusted relatively fast to minimize tip wear during one experiment. For hydrophobic surfaces, no signification change of adhesion force with humidity was observed. Adhesion force-versus-humidity curves recorded with hydrophilic surfaces either showed a maximum or continuously increased. I demonstrate that the results can be interpreted with simple continuum theory of the meniscus force. The meniscus force is calculated based on a model that includes surface roughness and takes into account different AFM tip (or particle) shapes by a two-sphere-model.Experimental and theoretical results show that the precise contact geometry has a critical influence on the humidity dependence of the adhesion force.Changes of tip geometry on the sub-10-nm length scale can completely change adhesion force-versus-humidity curves. Our model can also explain the differences between earlier AFM studies, where different dependencies of the adhesion force on humidity were observed.Keywords: Atomic force microscopy (AFM), cantile...

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“…This is consistent with the fact that citrate has little adsorption onto silica particles. Yoon et al [69] reported that higher adhesion force between two surfaces caused higher friction force on them. Figure 16.29 shows the removal rate of copper under different polishing conditions.…”

Section: Friction Force In Cu Cmp Processmentioning

confidence: 99%

Post‐CMP Cleaning

Park

Kim

2007

Microelectronic Applications of Chemical Mechanical Planarization

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With the decrease in device feature sizes, planarization of both front-and back-end layers by the chemical-mechanical planarization (CMP) process has become necessary for integrated circuit (IC) fabrication technologies smaller than 0.35 mm. As much as the industry has benefitted tremendously from the introduction and implementation of CMP, the very process has also brought along a set of new challenges to the fabs. For example, surface defects or imperfections such as leftover particles, organic residues, metallic contaminations, scratches, and corrosion spots can often be found on the polished wafers after the CMP process. These CMP-induced defects can arise from the slurries, the polishing pad, the pad conditioner, and to a lesser extent, the polisher. The leftover particles can physically attach to the wafer surface or, in the worst case, even partially embed into the top layer of a wafer. The CMP process can also leave metallic contamination typically in the range of 10 11 -10 12 atoms/ cm 2 . These contaminants mainly arise from the abraded metal lines, metal ions in the slurries, and polishers. In front-end applications such as a shallow trench isolation (STI) process, the control of metallic contamination levels is very critical because the following high-temperature process may lead to a complete incorporation of the metal ions into the lattice. In the case of back-end processes, if not removed, these metal contaminants can lower the breakdown voltage of devices. Also, fast diffusers such as copper can reach the active area from the backside surface or edge during the following thermal process [1]. During CMP, slurry additives and pad debris can leave organic residues on the Microelectronic Applications of Chemical Mechanical Planarization, Edited by Yuzhuo Li

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An experimental study on the adhesion at a nano-contact

Cited by 77 publications

References 14 publications

Force measurements with the atomic force microscope: Technique, interpretation and applications

Force measurements with the atomic force microscope: Technique, interpretation and applications

On the Adhesion between Fine Particles and Nanocontacts: An Atomic Force Microscope Study

Post‐CMP Cleaning

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