An experimental study on the heat dissipation of LED lighting module using metal/carbon foam

Yang, Kai-Shing; Chung, Chi-Hung; Lee, Ming-Tsang; Chiang, Song-Bor; Wong, C. M.; Wang, Chi-Chuan

doi:10.1016/j.icheatmasstransfer.2013.08.022

Cited by 46 publications

(17 citation statements)

References 17 publications

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“…Some researchers improved fin efficiency by changing the working principles of the conventional fin heat sink. Yang et al [229] brazed a layer of metal foam and carbon foam on the n fin surface. Through experiments, they found that the metal/carbon foam could enhance the heat transfer performance due to the relatively higher emissivity.…”

Section: Passive Cooling A) Substratementioning

confidence: 99%

Heat and fluid flow in high-power LED packaging and applications

Luo

Qiu

Liu

et al. 2016

Progress in Energy and Combustion Science

412

121

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Light-emitting diodes (LEDs) are widely used in our daily lives. Both light and heat are generated from LED chips and then transmitted or conducted through multiple packaging materials and interfaces. Part of the transmitted light converts into heat along the light propagation; in return, the accumulation of heat leads to the degradation of light output. The accumulated heat negatively influences the reliability and longevity of LEDs, and thus thermal management is critical for LED packaging and applications. On the other hand, in LED packaging processes, many fluid flow problems exist, such as phosphor coating, silicone injection, chip bonding, solder reflow, etc. Amongst them, phosphor coating is the most important process which is essential for LED performance. Phosphor gel is a kind of non-Newton fluid and its coating process is a typical fluid-flow problem. Overall, since LED packaging and applications present many heat and fluid flow problems, obtaining a full understanding of these problems enables advancements in the development of LED processes and designs. In this review, the emphasis is placed on heat generation in chips, heat flow in packages and application products, fluid flow in phosphor coating process, etc. This is a domain in which significant progress has been achieved in the last decade, and reporting on these advances will facilitate state-of-the-art LED packaging and application technologies.

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Section: Passive Cooling A) Substratementioning

confidence: 99%

Heat and fluid flow in high-power LED packaging and applications

Luo

Qiu

Liu

et al. 2016

Progress in Energy and Combustion Science

412

121

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“…The thermal resistance value for each part of the component can be further determined. Refer to the literature [9] for measurement theory details.…”

Section: Measurement Theorymentioning

confidence: 99%

Heat Transfer Characteristics in High Power LED Packaging

et al. 2014

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“…We hypothesized the porous Cu interlayer to function as a metal foam allowing the molten solder alloy to penetrate into its internal porous structure to achieve a better joint quality [20]. …”

Section: Introductionmentioning

confidence: 99%

Utilization of a Porous Cu Interlayer for the Enhancement of Pb-Free Sn-3.0Ag-0.5Cu Solder Joint

Jamadon

Tan

Yusof

et al. 2016

Metals

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Abstract:The joining of lead-free Sn-3.0Ag-0.5Cu (SAC305) solder alloy to metal substrate with the addition of a porous Cu interlayer was investigated. Two types of porous Cu interlayers, namely 15 ppi-pore per inch (P15) and 25 ppi (P25) were sandwiched in between SAC305/Cu substrate. The soldering process was carried out at soldering time of 60, 180, and 300 s at three temperature levels of 267, 287, and 307 • C. The joint strength was evaluated by tensile testing. The highest strength for solder joints with addition of P25 and P15 porous Cu was 51 MPa (at 180 s and 307 • C) and 54 MPa (at 300 s and 307 • C ), respectively. The fractography of the solder joint was analyzed by optical microscope (OM) and scanning electron microscopy (SEM). The results showed that the propagation of fracture during tensile tests for solder with a porous Cu interlayer occurred in three regions: (i) SAC305/Cu interface; (ii) inside SAC305 solder alloy; and (iii) inside porous Cu. Energy dispersive X-ray spectroscopy (EDX) was used to identify intermetallic phases. Cu 6 Sn 5 phase with scallop-liked morphology was observed at the interface of the SAC305/Cu substrate. In contrast, the scallop-liked intermetallic phase together with more uniform but a less defined scallop-liked phase was observed at the interface of porous Cu and solder alloy.

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An experimental study on the heat dissipation of LED lighting module using metal/carbon foam

Cited by 46 publications

References 17 publications

Heat and fluid flow in high-power LED packaging and applications

Heat and fluid flow in high-power LED packaging and applications

Heat Transfer Characteristics in High Power LED Packaging

Utilization of a Porous Cu Interlayer for the Enhancement of Pb-Free Sn-3.0Ag-0.5Cu Solder Joint

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