2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) 2023
DOI: 10.1109/eptc59621.2023.10457640
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An Extensive Study of the Effects of Packaging Structure and Material Properties on Reliability of Advanced Packages by Charactering the Stress Singularities at Interface Corners

Guang-Chao Lyu,
Bin Chen,
Xin-Ping Zhang
et al.
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