An Implantable 64-Channel Wireless Microsystem for Single-Unit Neural Recording

Silicon-Integrated High-Density Electrocortical Interfaces

“…Some of these IMDs can be wholly placed on the cortex within a very limited geometry as shown in Fig. 2(b) In other cases, only the electrode array is placed on the cortex while the other components can be located in the empty space created by a craniotomy [122], or under the scalp with lead wires connected [123], [124]. Regardless of placement, this constrained environment poses a difficult power challenge.…”

State-of-the-art MEMS and microsystem tools for brain research

“…This technique spread throughout the MEMS community and formed the basis for many other novel electromechanical structures. The planar lithography approach has evolved over the years to include integrated interconnects 38 , active electronics 35,39,40 , cochlear implants 41,42 , polytrodes 31 , and three-dimensional arrays 29,[43][44][45] . An important simplification for defining and releasing fine neural probe structures has been the use of silicon-on-insulator (SOI) wafers and deep reactive ion etching (DRIE) 46,47 that many groups have adopted.…”

“…Some of most advanced silicon designs include double-sided, high-density arrays 29,102 , three-dimensional arrangements 43 , and integrated electronics 39,40,132 . Although the inherent brittleness of silicon is a concern for some clinical applications, its electrical, mechanical, and thermal properties offer the greatest design options and are supported by a wide range of commercial microfabrication tools.…”

Wireless Telemetry for Implantable Biomedical Microsystems

“…A side benefit for increasing the modulation index to 100% is the power saving achieved by not spending energy to transmit logical 0's to the outside. Examples of using OOK only for data telemetry are (Yu & Bashirullah, 2006;Sodagar, et al, & 2009a. Early attempts in designing IBM wireless links for both power and data telemetry employed ASK technique for modulation.…”