An Improved Adaptive Genetic Algorithm for Image Segmentation and Vision Alignment Used in Microelectronic Bonding

Wang, Fujun; Li, Junlan; Liu, Shiwei; Zhao, Xingyu; Zhang, Dawei; Tian, Yanling

doi:10.1109/tmech.2013.2260555

Cited by 53 publications

(25 citation statements)

References 28 publications

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“…Actual positioning experiments for microelectronic thermosonic bonding were carried out with the aid of a vision system [27], and the experimental results show that the positioning with sub-micrometer accuracy within large motion strokes can be accomplished.…”

Section: Methodsmentioning

confidence: 99%

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A Flexure-Based Kinematically Decoupled Micropositioning Stage With a Centimeter Range Dedicated to Micro/Nano Manufacturing

Wang¹,

Liang²,

Tian³

et al. 2016

IEEE/ASME Trans. Mechatron.

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Dawei. (2015) A flexure-based kinematically decoupled micropositioning stage with a centimeter range dedicated to micro/nano manufacturing. IEEE/ASME Transactions on Mechatronics . Permanent WRAP url:http://wrap.warwick.ac.uk/76692 Copyright and reuse:The Warwick Research Archive Portal (WRAP) makes this work by researchers of the University of Warwick available open access under the following conditions. Copyright © and all moral rights to the version of the paper presented here belong to the individual author(s) and/or other copyright owners. To the extent reasonable and practicable the material made available in WRAP has been checked for eligibility before being made available.Copies of full items can be used for personal research or study, educational, or not-for profit purposes without prior permission or charge. Provided that the authors, title and full bibliographic details are credited, a hyperlink and/or URL is given for the original metadata page and the content is not changed in any way.Publisher's statement: "© 2015 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting /republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works." A note on versions:The version presented here may differ from the published version or, version of record, if you wish to cite this item you are advised to consult the publisher's version. Please see the 'permanent WRAP url' above for details on accessing the published version and note that access may require a subscription.

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Section: Methodsmentioning

confidence: 99%

“…The linear compliance of the flexure hinge along X-axis can be calculated as [25] (27) where E is the Modulus of elasticity, / 2 t c γ = and…”

Section: Dynamic Rotation Along Z-axismentioning

confidence: 99%

A Flexure-Based Kinematically Decoupled Micropositioning Stage With a Centimeter Range Dedicated to Micro/Nano Manufacturing

Wang¹,

Liang²,

Tian³

et al. 2016

IEEE/ASME Trans. Mechatron.

Self Cite

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“…As an important cost-effective and flexible interconnecting technology for microdevice packaging, thermosonic wire bondinghas been widely used for themicroelectronic packaging of nearly any type of daily used electronic products [4] . Automatic wire bonders are important equipments for wire bonding, and high performance wire bondersare required to produce smaller pad size and finer pitch of microelectronic products in extreme conditions [5,6] As an important component of automatic wire bonders, wire clamps perform…”

Section: Introductionmentioning

confidence: 99%

Development of a high speed and precision wire clamp with both position and force regulations

Liang

Wang

Tian

et al. 2017

Robotics and Computer-Integrated Manufacturing

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Development of a high speed and precision wire clamp with both position and force regulations. . Permanent WRAP URL:http://wrap.warwick.ac.uk/94028 Copyright and reuse:The Warwick Research Archive Portal (WRAP) makes this work by researchers of the University of Warwick available open access under the following conditions. Copyright © and all moral rights to the version of the paper presented here belong to the individual author(s) and/or other copyright owners. To the extent reasonable and practicable the material made available in WRAP has been checked for eligibility before being made available.Copies of full items can be used for personal research or study, educational, or not-for-profit purposes without prior permission or charge. Provided that the authors, title and full bibliographic details are credited, a hyperlink and/or URL is given for the original metadata page and the content is not changed in any way.

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“…ECENTLY the trend towards miniaturizing products such as Micro-Electro-Mechanical System(MEMS) has stimulated extensive research on automated micro manipulation and assembly techniques [1]- [6], and the development of miniaturized system for manipulating and assembling micro objects has become a great challenge for the precision engineering future [7]. Compared with other contact and contactless micro manipulation and assembly techniques, such as optical, electrostatic, Bernoulli, ultrasonic and magnetic, microgrippers are more preferred, because of their ability to grasp different shaped objects with high precision and low cost [8].…”

Section: Introductionmentioning

confidence: 99%

Design of a Piezoelectric-Actuated Microgripper With a Three-Stage Flexure-Based Amplification

Wang

Liang

Tian

et al. 2015

IEEE/ASME Trans. Mechatron.

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160

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Dawei. (2015) Design of a Piezoelectric-actuated microgripper with a three-stage flexure-based amplification. IEEE/ASME Transactions on Mechatronics, 20 (5 Copies of full items can be used for personal research or study, educational, or not-for profit purposes without prior permission or charge. Provided that the authors, title and full bibliographic details are credited, a hyperlink and/or URL is given for the original metadata page and the content is not changed in any way.Publisher's statement: "© 2015 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting /republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works." http://dx.doi.org/10.1109/TMECH.2014.2368789 A note on versions:The version presented here may differ from the published version or, version of record, if you wish to cite this item you are advised to consult the publisher's version. Please see the 'permanent WRAP url' above for details on accessing the published version and note that access may require a subscription.

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An Improved Adaptive Genetic Algorithm for Image Segmentation and Vision Alignment Used in Microelectronic Bonding

Cited by 53 publications

References 28 publications

A Flexure-Based Kinematically Decoupled Micropositioning Stage With a Centimeter Range Dedicated to Micro/Nano Manufacturing

A Flexure-Based Kinematically Decoupled Micropositioning Stage With a Centimeter Range Dedicated to Micro/Nano Manufacturing

Development of a high speed and precision wire clamp with both position and force regulations

Design of a Piezoelectric-Actuated Microgripper With a Three-Stage Flexure-Based Amplification

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