An improved numerical method for predicting intermetallic layer thickness developed during the formation of solder joints on Cu substrates

Chada, Srinivas; Laub, W.; Fournelle, R.A.; Shangguan, Dongkai

doi:10.1007/s11664-999-0157-0

Cited by 55 publications

(36 citation statements)

References 3 publications

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“…The Cu-Sn assessment of Oh et al also includes descriptions for all solid phases while the assessment of Boettinger et al considered only solid phases that exist at temperatures below 350 °C. The description of the Ag-Cu system [17] was readjusted for the use with SGTE lattice stabilities using the experimental data set compiled by Krieg [16] . The extrapolation from these assessments gave a ternary eutectic at 216.9 °C and Sn-3.42 wt % Ag-0.67 wt % Cu.…”

Section: Phase Diagram Modelingmentioning

confidence: 99%

“…These selected data as well as the data from Loomans and Fine [7] and Chada et al [17] were then used to obtain a refined description of the Gibbs energy of the liquid phase. The program TERGSS by Lukas et al [18] which uses a least squares method was used for the optimization of the ternary excess parameters.…”

Section: Phase Diagram Modelingmentioning

confidence: 99%

“…12. The data from Chada et al [17] which were obtained from the isothermal saturation of a Sn-3.5 wt % Ag eutectic solder with Cu are compared with the calculated liquidus in Fig. 13.…”

Section: The Ag-cu-sn Eutecticmentioning

confidence: 99%

“…Figure 13. Calculated isopleth between Sn-Ag eutectic in the binary Sn-Ag system and pure Cu with the data of Chada et al [17] . This plot shows the predicted maximum solubility of Cu in liquid Sn-3.5 wt % Ag solder as a function of temperature.…”

Section: Stoichiometric Phasesmentioning

confidence: 99%

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Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys

Moon

Boettinger

Kattner

et al. 2000

Journal of Elec Materi

518

256

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Sn-rich alloys in the Sn-Ag-Cu system are being studied for their potential as Pb-free solders. Thus, the location of the ternary eutectic involving L, (Sn), Ag 3 Sn and Cu 6 Sn 5 phases is of critical interest. Phase diagram data in the Sn-rich corner of the Sn-Ag-Cu system are measured. The ternary eutectic is confirmed to be at a composition of 3.5 wt % Ag, 0.9 wt % Cu at a temperature of 217.2 ± 0.2 °C (2σ). A thermodynamic calculation of the Sn-rich part of the diagram from the three constituent binary systems and the available ternary data using the CALPHAD method is conducted. The best fit to the experimental data is 3.66 wt % Ag and 0.91 wt % Cu at a temperature of 216.3 °C. Using the thermodynamic description to obtain the enthalpy-temperature relation, the DTA signal is simulated and used to explain the difficulty of liquidus measurements in these alloys.

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Section: Phase Diagram Modelingmentioning

confidence: 99%

Section: Phase Diagram Modelingmentioning

confidence: 99%

“…12. The data from Chada et al [17] which were obtained from the isothermal saturation of a Sn-3.5 wt % Ag eutectic solder with Cu are compared with the calculated liquidus in Fig. 13.…”

Section: The Ag-cu-sn Eutecticmentioning

confidence: 99%

Section: Stoichiometric Phasesmentioning

confidence: 99%

See 2 more Smart Citations

Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys

Moon

Boettinger

Kattner

et al. 2000

Journal of Elec Materi

518

256

View full text Add to dashboard Cite

show abstract

“…4) Sn-9Zn and Sn-3.5Ag are the two important binary leadfree solders, 5,6) however, the inferior wettability and oxidation resistance of an Sn-9Zn solder alloy and high melting point (221 C) of an Sn-3.5Ag alloy limit their usage. 7,8) Takemoto and Funaki 9) have shown that Ag addition to an Sn-9Zn solder alloy can improve wettability between solder alloy and Cu substrate, because Ag addition reduces the potential difference between a base metal and a solder alloy. Chang et al 10) have pointed out that the solidus temperature of an Sn-9Zn-xAg solder alloy is 197 C and this decreases from 225.…”

Section: Introductionmentioning

confidence: 99%

Effect of Thermal Treatment on the Intermetallic Compounds Formed at Sn-9Zn-1.5Ag-xBi (x = 0 and 1) Lead-Free Solder/Cu Interface

Liu

Chen

et al. 2007

Mater. Trans.

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The formation of Intermetallic compounds (IMCs) at the interface between an Sn-9Zn-1.5Ag-xBi solder alloy and a Cu substrate dipped at 250 C and heat-treated at 150 C for various times has been investigated by an optical microscope (OM), an X-ray diffractometer (XRD) and a scanning electron microscope (SEM) with an energy dispersive spectrometer (EDS). The OM result shows the flat and smooth surface for the Sn9Zn-1.5Ag-1Bi solder alloy and Cu substrate after dipping at 250 C. The phases of IMCs formed are Cu 6 Sn 5 and Cu 5 Zn 8 for both lead-free solder alloys. After thermal treatment at 250 C for 200 h, the phases of IMCs are Cu 6 Sn 5 , Cu 5 Zn 8 and Ag 3 Sn. The Cu 6 Sn 5 has a scallop morphology, and is located at the interface between the solder and Cu substrate. The adhesion strength for the Sn-9Zn-1.5Ag-1Bi lead-free solder alloy is higher than the Sn-9Zn-1.5Ag solder alloy. After being heat-treated at 150 C, the adhesion strength of the Sn-9Zn-1.5Ag-1Bi solder alloy decreases from 12:67 AE 0:45 to 6:92 AE 0:38 MPa after thermal treatment for 200 h.

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Flux‐Driven Morphology Evolution

Гусак

2010

Diffusion‐Controlled Solid State Reactions

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An improved numerical method for predicting intermetallic layer thickness developed during the formation of solder joints on Cu substrates

Cited by 55 publications

References 3 publications

Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys

Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys

Effect of Thermal Treatment on the Intermetallic Compounds Formed at Sn-9Zn-1.5Ag-xBi (x = 0 and 1) Lead-Free Solder/Cu Interface

Flux‐Driven Morphology Evolution

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