An in situ scanning tunnelling microscopy study of bulk copper deposition and the influence of an organic additive

Nichols, Richard J.; Beckmann, Wolfgang; Meyer, H.; Batina, Nikola; Kolb, Dieter M.

doi:10.1016/0022-0728(92)80319-y

Cited by 106 publications

(46 citation statements)

References 26 publications

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“…Such an island of copper atoms should, in absence of strongly bound coadsorbates (SO2-does not qualify! ), continue to grow 3D [22] as Cu/Au(lll), in contrast to the observations. Clearly, if the thiolate layer is damaged by large negative potential excursions, 3D nodules do indeed develop [24,25].…”

Section: Thiolate Layers and The Electrodeposition Of Metalscontrasting

confidence: 99%

Copper Electrodeposition on Alkanethiolate Covered Gold Electrodes*

Cavalleri¹,

Bittner²,

Kind³

et al. 1997

Zeitschrift für Physikalische Chemie

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We have investigated the structure and thermal dynamics of alkanethiolate layers on Au(lll) with variable temperature scanning tunnelling microscopy (STM), X-ray photoelectron spectroscopy (XPS) and voltammetry. The results build the basis for a study of electrodeposition of copper on alkanethiolate-covered Au(lll). Electrodeposition has been studied as a function of the thiolate chain length, the deposition potential and the temperature. Time-resolved [1][2][3][4][5][6][7].

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Section: Thiolate Layers and The Electrodeposition Of Metalscontrasting

confidence: 99%

Copper Electrodeposition on Alkanethiolate Covered Gold Electrodes*

Cavalleri¹,

Bittner²,

Kind³

et al. 1997

Zeitschrift für Physikalische Chemie

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“…Usually, the metal penetrates the halogenide layer; the topmost structure can be addressed as a metal-halogenide coadsorbate [17,[33][34][35][36]. In the presence of a large surfactant molecule, crystal violet, in the electrolyte, an STM study indeed proved the 2D growth scenario [20,22]. This situation is already close to the technical application where 'brighteners' are added to metal plating baths to yield smooth deposits.…”

Section: Thiolate Layers and The Electrodeposition Of Metalsmentioning

confidence: 99%

Copper Electrodeposition on Alkanethiolate Covered Gold Electrodes*

Cavalleri¹,

Bittner²,

Kind³

et al. 1999

Zeitschrift Für Physikalische Chemie

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“…As well as being of fundamental interest, organic films on electrode surfaces are also of practical importance [1 -3). Notable examples include their application as corrosion inhibitors and metal plating bath additives [4,5).…”

Section: Introductionmentioning

confidence: 99%

Structural Aspects of Tetramethylthiourea Adsorption on Au(111) Electrodes Investigated by In Situ Scanning Tunnelling Microscopy

Bunge

Nichols

Baumgärtel

et al. 1995

Ber Bunsenges Phys Chem

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We have examined tetramethylthiourea (TMTU) adsorption on Au( 111) with capacitance measurements and in situ scanning tunnelling microscopy (STM). Capacitance measurements of the TMTU-containing solution indicate that the organic molecule is adsorbed over a wide potential range. High resolution STM images at + 20 mV are totally different to those in the absence of TMTU and point to an ordered structure of the organic adsorbate. Three distinctive bright spots are seen in the STM images. A model has been developed with the molecules lying near to horizontal on the surface, forming a (3 x 3) adlayer.

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An in situ scanning tunnelling microscopy study of bulk copper deposition and the influence of an organic additive

Cited by 106 publications

References 26 publications

Copper Electrodeposition on Alkanethiolate Covered Gold Electrodes*

Copper Electrodeposition on Alkanethiolate Covered Gold Electrodes*

Copper Electrodeposition on Alkanethiolate Covered Gold Electrodes*

Structural Aspects of Tetramethylthiourea Adsorption on Au(111) Electrodes Investigated by In Situ Scanning Tunnelling Microscopy

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