An Inkjet Printed Chipless RFID Sensor for Wireless Humidity Monitoring

Borgese, Michele; Dicandia, Francesco Alessio; Costa, Filippo; Genovesi, Simone; Manara, Giuliano

doi:10.1109/jsen.2017.2712190

Cited by 149 publications

(49 citation statements)

References 29 publications

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“…When the paper absorbs humidity from its environment, the dielectric constant of the capacitor alters accordingly, and those changes can be measured [12][13][14][15]. Additionally, wireless readout-options for such sensors have frequently been reported [16][17][18] paving the way for truly low-cost, sustainable and smart packaging solutions of the future [19,20]. At the same time, the paper's porosity as well as surface inhomogeneity and higher roughness compared to widely used polymer-based substrates create new challenges for the printing process, especially for printing methods that require low-viscous inks, such as inkjet-printing [6,21,22].…”

Section: Introductionmentioning

confidence: 99%

Evaluation of the Sheet Resistance of Inkjet-Printed Ag-Layers on Flexible, Uncoated Paper Substrates Using Van-der-Pauw’s Method

Zikulnig

Roshanghias

Rauter

et al. 2020

Sensors

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With the growing significance of printed sensors on the electronics market, new demands on quality and reproducibility have arisen. While most printing processes on standard substrates (e.g., Polyethylene terephthalate (PET)) are well-defined, the printing on substrates with rather porous, fibrous and rough surfaces (e.g., uncoated paper) contains new challenges. Especially in the case of inkjet-printing and other deposition techniques that require low-viscous nanoparticle inks the solvents and deposition materials might be absorbed, inhibiting the formation of homogeneous conductive layers. As part of this work, the sheet resistance of sintered inkjet-printed conductive silver (Ag-) nanoparticle cross structures on two different, commercially available, uncoated paper substrates using Van-der-Pauw's method is evaluated. The results are compared to the conductivity of well-studied, white heat stabilised and treated PET foil. While the sheet resistance on PET substrate is highly reproducible and the variations are solely process-dependent, the sheet resistance on uncoated paper depends more on the substrate properties themselves. The results indicate that the achievable conductivity as well as the reproducibility decrease with increasing substrate porosity and fibrousness.

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Section: Introductionmentioning

confidence: 99%

Evaluation of the Sheet Resistance of Inkjet-Printed Ag-Layers on Flexible, Uncoated Paper Substrates Using Van-der-Pauw’s Method

Zikulnig

Roshanghias

Rauter

et al. 2020

Sensors

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show abstract

“…The main research efforts have been oriented to increase the number of bits that the electromagnetic structure can encode [1][2][3] or developing low cost printing techniques to manufacture low cost tags. However, this technology has also been proposed as a sensor [4][5][6][7][8][9][10][11]. In this case, due to the limited number of sensors within the read range of the tag, a large number of bits to perform the identification is not necessary.…”

Section: Introductionmentioning

confidence: 99%

Chipless Dielectric Constant Sensor for Structural Health Testing

et al. 2018

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A low-cost chipless RFID sensor tag to determine the dielectric properties of materials is presented. The sensor is based on a depolarizing dipole resonator loaded with printed capacitors whose capacitance depends on the permittivity of the material located on contact with the tag. The permittivity is obtained from the shift of the resonance frequency. The resonator is tested both individually as well as placed on a periodic arrangement so as to form a frequency selective structure (FSS) to increase the crosspolar radar cross section, thus facilitating the tag detection. The proposed structure and measurement procedure is particularly suitable for the characterization of civil materials as a nondestructive testing (NDT).

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“…The thermal conductivity of cellulose papers with a copper filler content of up 14.3 wt% (or a ratio of 1:6 between copper particles and pulp fibers) could already be dramatically increased . In previous studies, electronic circuits and piezoelectric structures had been printed onto cellulose papers . Similarly, circuit structures made from Ti 2 SiC 3 could be successfully ink‐jet printed onto preceramic alumina papers by Carrijo et al The circuitry patterns on highly filled papers might be integrated into low voltage energy sources, memory cells or a variety of sensors.…”

Section: Applications Of Highly Filled Papers and Paper‐derived Matermentioning

confidence: 99%

Highly Filled Papers, on their Manufacturing, Processing, and Applications

et al. 2019

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Since more than a decade ago, the research on highly filled papers, as well as paper-derived inorganic materials, has greatly intensified. As presented in this review, highly filled papers as preforms allow for the design of porous or dense, multilayered, and geometrically complex structures. These paperderived ceramic-or metal-based materials are generated by the heattreatment of highly filled papers. Paper-derived materials are potential materials of choice for applications in transportation, energy-generation, environmental conservation, support structures, medical uses, and electronic components. Due to the adjustability of the filler content and the good machinability of highly filled papers, paper-derived sheets or multilayers may include intricate structures and tailored gradients in phase structure or porosity. Paper-derived multilayers also may contain cast ceramic tapes or other functionalized layers, as presented in some examples. Computer-aided manufacturing processes for paper-derived materials can be supplemented by prediction models for the sintering shrinkage in order to identify optimal post-processing steps, stacking orders and orientations for highly filled paper layers within multilayer green bodies. The accuracy of established component-level sintering models can be significantly increased by microstructure models of the highly filled paper. ParameterName Unit α Mismatch parameter for fiber cross-sections, Equation (5) Dimensionless α p Layer position in viscoelastic paper structure model, Equation (2) Dimensionless A 0 Initial amplitude of perturbation, Equations (15) 10 À6 m A(f) Parameter for evolution of instantaneous carbon conversion rate, Equation (7) Dimensionless A diff Source controlled diffusion parameter, Equations (9) 10 À7 N A match Modeling parameter, Equations (8) Dimensionless a Inter-particle contact-area radius, Equations (19) 10 À8 m a Local average pore area, Equation (4) 10 À6 m 2 b Pore geometry constant, Equation (20) Dimensionless ß evo , m evo Empirical constants for grain evolution in SOVS model, Equation (8) Dimensionless ß r(c)p Proportionality constant for bimodal packing fraction determination, Equation (18) Dimensionless C Modeling constant for debindering pressure calculation, Equation (7) 10 À6 (m 2 Á s)/K C 1 , C 2 , C 3 , C 4 , C 5 Parameters in the Riedel model that are determined by the dihedral angle, Equations (9) Dimensionless c glue Heat capacity of the adhesive layers, Equation (3) 10 À6 s c L , c s Volume fraction of larger-sized/smaller-sized particles in a multimodal mixture of particles, Equation (17)and (18) 10 0 vol% c vol Volume concentration of pulp fibers, Equation (4) 10 0 vol% γ, γ 0 Strain relaxation rate of calendered paper with initial value, Equation (2) Dimensionless γ B Grain boundary energy density, Equation (13) 10 0 J m À2 γ b Specific energy for grain boundary diffusion, Equation (9) 10 3 J mol À1 γ S Material surface energy, Equation (8, 11, and 13) 10 0 J m À2 Δ Half of the inter-particle boundary thickness, Equation (19) 10 À8...

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An Inkjet Printed Chipless RFID Sensor for Wireless Humidity Monitoring

Cited by 149 publications

References 29 publications

Evaluation of the Sheet Resistance of Inkjet-Printed Ag-Layers on Flexible, Uncoated Paper Substrates Using Van-der-Pauw’s Method

Evaluation of the Sheet Resistance of Inkjet-Printed Ag-Layers on Flexible, Uncoated Paper Substrates Using Van-der-Pauw’s Method

Chipless Dielectric Constant Sensor for Structural Health Testing

Highly Filled Papers, on their Manufacturing, Processing, and Applications

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