An innovative process to fabricate copper/diamond composite films for thermal management applications

Guillemet, Thomas; Geffroy, Pierre-Marie; Heintz, Jean‐Marc; Chandra, Namas; Lu, Yongfeng; Silvain, Jean François

doi:10.1016/j.compositesa.2012.04.015

Cited by 34 publications

(22 citation statements)

References 14 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The Cu coating is efficient as interfacial bonding agent, heat transfer agent, and thermo-mechanical load transfer agent. The Cu coating process also shows high repeatability, tunability, and scalability, [10] thus providing an innovative carbide-free alternative for heattransfer at the Cu/D interface.…”

mentioning

confidence: 99%

“…Thermal and mechanical properties of D and Cu can be combined to obtain Cu/D heat-dissipative composite materials with thermal conductivity and a CTE that can be tailored with respect to the volume fraction of diamond reinforcements. From this perspective, Cu/D composites have attracted significant interest in recent years [10][11][12][13][14] and are considered as promising thermal management materials with the following advantages over pure Cu: 1) lower density, 2) higher thermal conductivity, 3) lower CTE. The costly aspect of Cu/D composites, of which scope of application has long been restricted to small volume markets such as the military and the aerospace industries, has long been a major limit to their development.…”

mentioning

confidence: 99%

“…The costly aspect of Cu/D composites, of which scope of application has long been restricted to small volume markets such as the military and the aerospace industries, has long been a major limit to their development. Ramping-up heat flux levels combined with the inception of cheaper fabrication methods for Cu/D composites [10] now allow to consider the choice of these materials in an economically consistent manner.…”

mentioning

confidence: 99%

“…[11][12][13][14] In a previous study, [10] we developed a process to fabricate Cu/D composites for thermal management applications without carbide forming additives to bond the Cu matrix to the diamond reinforcements. This process consists of coating the diamond powder with Cu submicronic and nanometric particles before sintering.…”

mentioning

confidence: 99%

“…[8][9][10] Thus, it is interesting to explore the use of diamond as reinforcements embedded in a thermal package substrate, such as a Cu matrix. Thermal and mechanical properties of D and Cu can be combined to obtain Cu/D heat-dissipative composite materials with thermal conductivity and a CTE that can be tailored with respect to the volume fraction of diamond reinforcements.…”

mentioning

confidence: 99%

See 4 more Smart Citations

Formation of Cu Nanodots on Diamond Surface to Improve Heat Transfer in Cu/D Composites

Guillemet

Heintz

Mortaigne³

et al. 2017

Adv Eng Mater

Self Cite

View full text Add to dashboard Cite

Diamond-dispersed copper matrix (Cu/D) composite materials with different interfacial configurations are fabricated through powder metallurgy and their thermal performances are evaluated. An innovative solution to chemically bond copper (Cu) to diamond (D) has been investigated and compared to the traditional Cu/D bonding process involving carbide-forming additives such as boron (B) or chromium (Cr). The proposed solution consists of coating diamond reinforcements with Cu particles through a gas-solid nucleation and growth process. The Cu particle-coating acts as a chemical bonding agent at the Cu-D interface during hot pressing, leading to cohesive and thermally conductive Cu/D composites with no carbide-forming additives. Investigation of the microstructure of the Cu/D materials through scanning electron microscopy, transmission electron microscopy, and atomic force microscopy analyses is coupled with thermal performance evaluations through thermal diffusivity, dilatometry, and thermal cycling. Cu/D composites fabricated with 40 vol% of Cu-coated diamonds exhibit a thermal conductivity of 475 W m À1 K À1 and a thermal expansion coefficient of 12 Â 10 À6 C À1 . These promising thermal performances are superior to that of B-carbide-bonded Cu/D composites and similar to that of Cr-carbidebonded Cu/D composites fabricated in this study. Moreover, the Cu/D composites fabricated with Cu-coated diamonds exhibit higher thermal cycling resistance than carbide-bonded materials, which are affected by the brittleness of the carbide interphase upon repeated heating and cooling cycles. The as-developed materials can be applicable as heat spreaders for thermal management of power electronic packages. The copper-carbon chemical bonding solution proposed in this article may also be found interesting to other areas of electronic packaging, such as brazing solders, direct bonded copper substrates, and polymer coatings.

show abstract

mentioning

confidence: 99%

mentioning

confidence: 99%

mentioning

confidence: 99%

mentioning

confidence: 99%

mentioning

confidence: 99%

See 3 more Smart Citations

Formation of Cu Nanodots on Diamond Surface to Improve Heat Transfer in Cu/D Composites

Guillemet

Heintz

Mortaigne³

et al. 2017

Adv Eng Mater

Self Cite

View full text Add to dashboard Cite

show abstract

Effect of Thermal Cycling on Thermal Conductivity of Powder Injection Moulded MWCNT Reinforced Copper Matrix Composites

Ahmad

Mohammad

Muhsan

et al. 2019

Advances in Material Sciences and Engineering

View full text Add to dashboard Cite

Design, manufacturing, and testing of a laser textured piston ring surface reinforced with a CuCoBe–diamond composite by hot-pressing

Ferreira

Cunha

Carvalho

et al. 2023

Int J Adv Manuf Technol

View full text Add to dashboard Cite

A CuCoBe–diamond composite was used to reinforce a laser textured 410 stainless steel piston ring by hot-pressing. Different hot-pressing parameters were used to optimize the sintering process of the CuCoBe particles (P = 25 and 50 MPa, T = 820 and 980 °C, and t = 15 and 30 min). The results showed an increase in the hardness of the hot-pressed samples (50.5% and 48.5% for P = 25 and 50 MPa, respectively). Three textures with different track widths and distances between them were produced by laser on the compression piston rings’ surface. The composite powders were used for the reinforcement of the textures by hot-pressing at the optimized sintering parameters (T = 980 °C, P = 25 and 50 MPa, and t = 15 min). The tribological results revealed that larger texture dimensions led to enhanced tribological performance.

show abstract

An innovative process to fabricate copper/diamond composite films for thermal management applications

Cited by 34 publications

References 14 publications

Formation of Cu Nanodots on Diamond Surface to Improve Heat Transfer in Cu/D Composites

Formation of Cu Nanodots on Diamond Surface to Improve Heat Transfer in Cu/D Composites

Effect of Thermal Cycling on Thermal Conductivity of Powder Injection Moulded MWCNT Reinforced Copper Matrix Composites

Design, manufacturing, and testing of a laser textured piston ring surface reinforced with a CuCoBe–diamond composite by hot-pressing

Contact Info

Product

Resources

About